Inventor · disambiguated record
Cheng-Jen Liang
Also filed as: LIANG CHENG-JEN
8 granted patents·2 pending applications·48 citations·filing 2007–2021
80Inventor score
Top patents by PatentIndex Score
10 records- 0190US7489510B1Fastening device for mounting thermal module to electronic componentFOXCONN TECH CO LTD·Filed 2007·Granted Feb 10, 2009·25 cites·18 claims
- 0289US7839630B2Heat dissipation device and computer using sameFURUI PRECISE COMPONENT KUNSHA·Filed 2009·Granted Nov 23, 2010·21 cites·14 claims
- 0362US7701717B2Notebook computer having heat pipeFOXCONN TECH CO LTD·Filed 2008·Granted Apr 20, 2010·2 cites·8 claims
- 0461US2011030923A1Thermal moduleFOXCONN TECH CO LTD·Filed 2009·Application pending·0 cites
- 0548US11280561B2Current stabilization and pressure boosting device for evaporatorLDC PREC ENGINEERING CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·4 claims
- 0646US11747091B2Fast heat-sinking device for evaporatorsLDC PREC ENGINEERING CO LTD·Filed 2021·Granted Sep 5, 2023·0 cites·6 claims
- 0744US11280556B2Fast heat-sinking, current stabilization and pressure boosting device for condenserLDC PREC ENGINEERING CO LTD·Filed 2020·Granted Mar 22, 2022·0 cites·10 claims
- 0844US2011047796A1Method for manufacturing heat pipe with artery pipeFOXCONN TECH CO LTD·Filed 2009·Application pending·0 cites
- 0942US11064632B2Heat-sinking improved structure for evaporatorsLDC PREC ENGINEERING CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·8 claims
- 1037US10962299B2Evaporator structure with improved layout of cooling fluid channelsLDC PREC ENGINEERING CO LTD·Filed 2018·Granted Mar 30, 2021·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →