Inventor · disambiguated record

Chin-Chin Liao

Also filed as: LIAO CHIH-CHIN

1 granted patent·1 citations·filing 2013–2013

17Inventor score

Technology areasH10W

Files withSANDISK TECHNOLOGIES INC1

Top patents by PatentIndex Score

1 record

0161US8853863B2Semiconductor device with die stack arrangement including staggered die and efficient wire bondingSANDISK TECHNOLOGIES INC·Filed 2013·Granted Oct 7, 2014·1 cites·16 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →