Inventor · disambiguated record
Chung-Hsien Liao
Also filed as: LIAO CHUNG HSIEN
4 granted patents·5 pending applications·0 citations·filing 2015–2024
56Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD9
Top patents by PatentIndex Score
9 records- 0171US2024153810A1Vacuum wafer chuck for manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0269US11901215B2Vacuum wafer chuck for manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 0363US11335585B2Vacuum wafer chuck for manufacturing semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 0458US2025043420A1Atomic layer deposition (ald) with improved particle prevention mechanismTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0553US2025191945A1Smart wafer transport case with sensor systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0653US2025340988A1Semiconductor apparatus for gas mixing and method of film depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0752US2025046633A1Systems and methods for accurate determination of semiconductor wafer temperatureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0842US10269544B2Gas ring for plasma system and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·0 cites·20 claims
- 0934US10763082B2Chamber of plasma system, liner for plasma system and method for installing liner to plasma systemTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 1, 2020·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →