Inventor · disambiguated record
Chun-Ming Liao
Also filed as: LIAO CHUN-MING
1 granted patent·2 pending applications·12 citations·filing 2007–2008
34Inventor score
Technology areasH10W
Files withSILICONWARE PRECISION INDUSTRIES CO LTD3
Top patents by PatentIndex Score
3 records- 0181US7608915B2Heat dissipation semiconductor packageSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Granted Oct 27, 2009·12 cites·11 claims
- 0243US2008251910A1Fabricating method of semiconductor package and heat-dissipating structure applicable theretoSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2008·Application pending·0 cites
- 0339US2008157346A1Method for fabricating heat-dissipating package and heat-dissipating structure applicable theretoSILICONWARE PRECISION INDUSTRIES CO LTD·Filed 2007·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →