Inventor · disambiguated record
Chi-Wei Liao
Also filed as: LIAO CHI WEI
20 granted patents·7 pending applications·77 citations·filing 1998–2024
92Inventor score
Files withADVANCED OPTOELECTRONIC TECH9QUANZHOU SANAN SEMICONDUCTOR TECH CO LTD6XIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD4HSIEH MIN-TSUN3LIAO CHI-WEI2
Top patents by PatentIndex Score
27 records- 0196US11271362B2Laser device and light guide member used with the sameXIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2020·Granted Mar 8, 2022·5 cites·28 claims
- 0284US12080989B2Laser device and light guide member used with the sameXIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2023·Granted Sep 3, 2024·0 cites·20 claims
- 0377US11769985B2Laser device and light guide member used with the sameXIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 0476USD644189SLED light barADVANCED OPTOELECTRONIC TECH·Filed 2010·Granted Aug 30, 2011·22 cites·1 claims
- 0570US9048367B2Multichip package structure for generating a symmetrical and uniform light-blending sourceBRIGHTEK OPTOELECTRONIC CO LTD·Filed 2013·Granted Jun 2, 2015·4 cites·24 claims
- 0668US8459838B2Traffic lightLIAO CHI-WEI·Filed 2010·Granted Jun 11, 2013·5 cites·17 claims
- 0763US6070360APlant cultivating basinFiled 1998·Granted Jun 6, 2000·31 cites·1 claims
- 0861US8828755B2Light-emitting element package and fabrication method thereofADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Sep 9, 2014·0 cites·9 claims
- 0960US2024405185A1Light-emitting diode packaging moduleQUANZHOU SANAN SEMICONDUCTOR TECH CO LTD·Filed 2024·Application pending·0 cites
- 1057US8657469B2Traffic light assemblyADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Feb 25, 2014·1 cites·4 claims
- 1155US2021126423A1Laser diode packaging structure and light source module including the sameQUANZHOU SANAN SEMICONDUCTOR TECH CO LTD·Filed 2020·Application pending·0 cites
- 1251US12080688B2Light-emitting diode packaging moduleQUANZHOU SANAN SEMICONDUCTOR TECH CO LTD·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 1350US12237312B2Light-emitting diode packaging moduleQUANZHOU SANAN SEMICONDUCTOR TECH CO LTD·Filed 2022·Granted Feb 25, 2025·0 cites·19 claims
- 1450US12230611B2Light-emitting device and display screen including the sameQUANZHOU SANAN SEMICONDUCTOR TECH CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·24 claims
- 1549US12230612B2Light-emitting diode packaging module having encapsulated array of LED chipsQUANZHOU SANAN SEMICONDUCTOR TECH CO LTD·Filed 2022·Granted Feb 18, 2025·0 cites·20 claims
- 1649US8541799B2Light-emitting element package and fabrication method thereofHSIEH MIN-TSUN·Filed 2011·Granted Sep 24, 2013·0 cites·7 claims
- 1747US2009278152A1Light emitting diode and package method thereofADVANCED OPTOELECTRONIC TECH·Filed 2009·Application pending·0 cites
- 1845USD642994SLED light barADVANCED OPTOELECTRONIC TECH·Filed 2010·Granted Aug 9, 2011·5 cites·1 claims
- 1942US8344406B2Light emitting diode package and manufacturing method thereofADVANCED OPTOELECTRONIC TECH·Filed 2010·Granted Jan 1, 2013·0 cites·13 claims
- 2042US2011266574A1Led packageADVANCED OPTOELECTRONIC TECH·Filed 2011·Application pending·0 cites
- 2139USD642995SLED light barADVANCED OPTOELECTRONIC TECH·Filed 2010·Granted Aug 9, 2011·3 cites·1 claims
- 2238US2012020089A1Light emitting diode light barHSIEH MIN-TSUN·Filed 2011·Application pending·0 cites
- 2337US10833232B2LED deviceXIAMEN SANAN OPTOELECTRONICS TECHNOLOGY CO LTD·Filed 2018·Granted Nov 10, 2020·0 cites·9 claims
- 2437US2011297981A1Fluorescent structure and method for forming the fluorescent structure and led package using the sameLIAO CHI-WEI·Filed 2011·Application pending·0 cites
- 2533US2012043576A1Led package structureHSIEH MIN-TSUN·Filed 2011·Application pending·0 cites
- 2631USD640212SLED light barADVANCED OPTOELECTRIC TECHNOLOGY INC·Filed 2010·Granted Jun 21, 2011·1 cites·1 claims
- 2730USD642545SLED light barADVANCED OPTOELECTRONIC TECH·Filed 2010·Granted Aug 2, 2011·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →