Inventor · disambiguated record

Christoph Liebl

Also filed as: LIEBL CHRISTOPH

1 granted patent·2 pending applications·0 citations·filing 2018–2022

10Inventor score

Technology areasH10W

Files withINFINEON TECHNOLOGIES AG3

Top patents by PatentIndex Score

3 records

0146US2022415732A1Semiconductor module with shaped external contact for reduced crack formation in the encapsulation bodyINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
0240US10978378B2Encapsulated leadless package having an at least partially exposed interior sidewall of a chip carrierINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 13, 2021·0 cites·13 claims
0339US2020395334A1Method and Structure for Supporting Thin Semiconductor Chips with a Metal CarrierINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →