Inventor · disambiguated record
Chung-Cheng Lien
Also filed as: LIEN CHUNG C · LIEN CHUNG-CHENG
10 granted patents·18 pending applications·102 citations·filing 2004–2012
88Inventor score
Top patents by PatentIndex Score
28 records- 0191US7507915B2Stack structure of carrier boards embedded with semiconductor components and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Mar 24, 2009·31 cites·3 claims
- 0285US7656040B2Stack structure of circuit board with semiconductor component embedded thereinPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Feb 2, 2010·14 cites·16 claims
- 0385US7514770B2Stack structure of carrier board embedded with semiconductor components and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 7, 2009·15 cites·3 claims
- 0481US7706148B2Stack structure of circuit boards embedded with semiconductor chipsPHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Apr 27, 2010·10 cites·11 claims
- 0581US7674986B2Circuit board structure having capacitor array and embedded electronic component and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2006·Granted Mar 9, 2010·11 cites·14 claims
- 0679US7619317B2Carrier structure for semiconductor chip and method for manufacturing the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Nov 17, 2009·9 cites·6 claims
- 0776US7598610B2Plate structure having chip embedded therein and the manufacturing method of the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Granted Oct 6, 2009·7 cites·7 claims
- 0873US7863729B2Circuit board structure embedded with semiconductor chipsUNIMICRON TECHNOLOGY CORP·Filed 2009·Granted Jan 4, 2011·5 cites·10 claims
- 0948US2008230892A1Chip package modulePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 1047US2007284717A1Device embedded with semiconductor chip and stack structure of the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1147US2007181995A1Circuit board structure embedded with semiconductor chipsHSU SHIH PING·Filed 2006·Application pending·0 cites
- 1245US8642898B2Circuit board structure with capacitors embedded thereinLIEN CHUNG-CHENG·Filed 2012·Granted Feb 4, 2014·0 cites·5 claims
- 1345US2008237832A1Multi-chip semiconductor package structurePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 1445US2008237831A1Multi-chip semiconductor package structurePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 1545US2008237833A1Multi-chip semiconductor package structurePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 1644US8256106B2Method for fabricating circuit board structure with capacitors embedded thereinLIEN CHUNG-CHENG·Filed 2008·Granted Sep 4, 2012·0 cites·5 claims
- 1744US2009032930A1Packaging substrate having chip embedded therein and manufacturing method thereofPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 1844US2008224295A1Package structure and stacked package module using the samePHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 1943US2007241444A1Carrier board structure with chip embedded therein and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2043US2008029872A1Plate structure having chip embedded therein and the manufacturing method of the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2143US2008185704A1Carrier plate structure havign a chip embedded therein and the manufacturing method of the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2243US2008047740A1Circuit Board Assembly Having Passive Component and Stack Structure ThereofPHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2342US2008030965A1Circuit board structure with capacitors embedded therein and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2441US2007087547A1Wafer structure with electroless plating metal connecting layer and method for fabricating the sameCHEN SHANG W·Filed 2006·Application pending·0 cites
- 2540US2008217739A1Semiconductor packaging substrate structure with capacitor embedded thereinPHOENIX PREC TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
- 2637US2007085205A1Semiconductor device with electroless plating metal connecting layer and method for fabricating the sameCHEN SHANG-WEI·Filed 2006·Application pending·0 cites
- 2736US2008308309A1Structure of packaging substrate having capacitor embedded therein and method for fabricating the samePHOENIX PREC TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 2829US2005239269A1Method for releasing stress of embedded chip and chip embedded structurePHOENIX PREC TECHNOLOGY CORP·Filed 2004·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chung-Cheng Lien files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →