Inventor · disambiguated record
Chu Aun Lim
Also filed as: LIM CHU AUN
4 granted patents·15 pending applications·16 citations·filing 2002–2022
70Inventor score
Files withINTEL CORP19
Top patents by PatentIndex Score
19 records- 0167US11929295B2Multi-use package architectureINTEL CORP·Filed 2022·Granted Mar 12, 2024·0 cites·14 claims
- 0267US10317938B2Apparatus utilizing computer on package constructionINTEL CORP·Filed 2015·Granted Jun 11, 2019·2 cites·22 claims
- 0356US6885207B2Method and apparatus for testing electronic devicesINTEL CORP·Filed 2003·Granted Apr 26, 2005·7 cites·3 claims
- 0455US6597190B2Method and apparatus for testing electronic devicesINTEL CORP·Filed 2002·Granted Jul 22, 2003·7 cites·15 claims
- 0549US2019287872A1Multi-use package architectureINTEL CORP·Filed 2018·Application pending·0 cites
- 0649US2022110214A1Stepped package and recessed circuit boardINTEL CORP·Filed 2021·Application pending·0 cites
- 0747US2024234303A9Integrated inductor over transistor layerINTEL CORP·Filed 2022·Application pending·0 cites
- 0847US2024234234A9Copper fill for heat management in integrated circuit deviceINTEL CORP·Filed 2022·Application pending·0 cites
- 0947US2023395524A1Emi cage for microstrip routing via dual layer underfill conceptINTEL CORP·Filed 2022·Application pending·0 cites
- 1046US2023395578A1Memory package on extended base die over soc die for package layer count and form factor reductionINTEL CORP·Filed 2022·Application pending·0 cites
- 1146US2023420354A1Electrical conductor extending from a surface of a substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 1246US2023420384A1Slotted stiffener for a package substrateINTEL CORP·Filed 2022·Application pending·0 cites
- 1346US2023395576A1Memory on package (mop) architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 1446US2023420350A1Hyper density package substrate and memory coupled to a modified semi-additive process boardINTEL CORP·Filed 2022·Application pending·0 cites
- 1546US2023395493A1On package interconnect architecture for high-speed memoryINTEL CORP·Filed 2022·Application pending·0 cites
- 1646US2023420345A1Copper rings for bga count reduction in small form factor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 1746US2023395577A1Soc-memory integration to achieve smallest and thinnest memory on package architectureINTEL CORP·Filed 2022·Application pending·0 cites
- 1846US2023397333A1Ultra-laser though hole (ulth) by multi-stacked core conceptINTEL CORP·Filed 2022·Application pending·0 cites
- 1933US2021202441A1System and method for stacking wire-bond converted flip-chip dieINTEL CORP·Filed 2016·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chu Aun Lim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →