Inventor · disambiguated record
Chew Ching Lim
Also filed as: LIM CHEW CHING
4 granted patents·1 pending application·13 citations·filing 2014–2023
66Inventor score
Top patents by PatentIndex Score
5 records- 0183US9425174B1Integrated circuit package with solderless interconnection structureALTERA CORP·Filed 2014·Granted Aug 23, 2016·8 cites·4 claims
- 0278US9633874B1Package substrate warpage reshaping apparatus and methodALTERA CORP·Filed 2014·Granted Apr 25, 2017·5 cites·20 claims
- 0348US2024332127A1On-package embedded cooling deviceINTEL CORP·Filed 2023·Application pending·0 cites
- 0447US11495514B2Bathtub integrated heat spreader with multiple thermal-interface material for integrated-circuit packagesINTEL CORP·Filed 2020·Granted Nov 8, 2022·0 cites·19 claims
- 0543US11521940B2Stiffener for die crack prevention in semiconductor packagesINTEL CORP·Filed 2020·Granted Dec 6, 2022·0 cites·16 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →