Inventor · disambiguated record
Chong Han Lim
Also filed as: LIM CHONG HAN
6 granted patents·3 pending applications·21 citations·filing 2004–2024
77Inventor score
Top patents by PatentIndex Score
9 records- 0191US11791170B2Universal semiconductor package moldsTEXAS INSTRUMENTS INC·Filed 2021·Granted Oct 17, 2023·2 cites·16 claims
- 0289US12119289B2Semiconductor packages with roughened conductive componentsTEXAS INSTRUMENTS INC·Filed 2023·Granted Oct 15, 2024·2 cites·25 claims
- 0385US11715678B2Roughened conductive componentsTEXAS INSTRUMENTS INC·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 0473US2024429134A1Semiconductor packages with roughened conductive componentsTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0562US6940299B1Method of testing for short circuits between adjacent input/output pins of an integrated circuitNAT SEMICONDUCTOR CORP·Filed 2004·Granted Sep 6, 2005·15 cites·13 claims
- 0652US2021043466A1Universal semiconductor package moldsTEXAS INSTRUMENTS INC·Filed 2019·Application pending·0 cites
- 0751US11626350B2Cutting a leadframe assembly with a plurality of punching toolsTEXAS INSTRUMENTS INC·Filed 2020·Granted Apr 11, 2023·0 cites·9 claims
- 0846US2024258120A1Laser-cut lead frame for integrated circuit (ic) packagesTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0943US10381293B2Integrated circuit package having an IC die between top and bottom leadframesTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 13, 2019·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →