Inventor · disambiguated record
Chia-Chieh Lin
Also filed as: LIN CHIA-CHIEH
13 granted patents·3 pending applications·31 citations·filing 2010–2025
88Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD12CHICONY POWER TECH CO LTD1LIN CHIA-CHIEH1TAIWAN SEMICONDUCTOR MFG1TSAI CHAO-WEI1
Top patents by PatentIndex Score
16 records- 0195US9553020B2Interconnect structure for connecting dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 24, 2017·12 cites·20 claims
- 0291US10056353B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 21, 2018·9 cites·20 claims
- 0391US2025364494A13DIC Interconnect Apparatus and MethodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0490US11798916B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Oct 24, 2023·5 cites·7 claims
- 0581US12476224B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 18, 2025·0 cites·20 claims
- 0677US10096515B2Interconnect structure for stacked deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Oct 9, 2018·3 cites·20 claims
- 0772US9076715B2Interconnect structure for connecting dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 7, 2015·2 cites·20 claims
- 0871US11915977B2Interconnect structure for stacked deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·0 cites·20 claims
- 0963US10840287B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·0 cites·20 claims
- 1059US10978345B2Interconnect structure for stacked deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 13, 2021·0 cites·20 claims
- 1159US10361234B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 23, 2019·0 cites·20 claims
- 1255US9941320B23DIC interconnect apparatus and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 10, 2018·0 cites·20 claims
- 1352US9406712B2Interconnect structure for connecting dies and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 2, 2016·0 cites·20 claims
- 1435US2014119058A1Power voltage conversion system for controller integrated circuitCHICONY POWER TECH CO LTD·Filed 2012·Application pending·0 cites
- 1534US8461908B1Current compensating deviceTSAI CHAO-WEI·Filed 2011·Granted Jun 11, 2013·0 cites·6 claims
- 1634US2012112643A1Light-emitting diode lamp with multi-channel constant-voltage and constant-current controlLIN CHIA-CHIEH·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →