Inventor · disambiguated record
Chung-Yi Lin
Also filed as: LIN CHUNG-YI
41 granted patents·17 pending applications·464 citations·filing 2001–2025
97Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD22TAIWAN SEMICONDUCTOR MFG9FIRST DOME CORP5SHIN ZU SHING CO LTD4HON HAI PREC IND CO LTD3
Top patents by PatentIndex Score
58 records- 0196US9099530B2Methods of patterning small via pitch dimensionsTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 4, 2015·108 cites·20 claims
- 0294US8728332B2Methods of patterning small via pitch dimensionsLIN CHUNG-YI·Filed 2012·Granted May 20, 2014·152 cites·19 claims
- 0392US9524000B2Pivot mechanism of synchronous hinge deviceFIRST DOME CORP·Filed 2014·Granted Dec 20, 2016·24 cites·26 claims
- 0489US9310849B2Dual-shaft synchronous transmission deviceFIRST DOME CORP·Filed 2014·Granted Apr 12, 2016·14 cites·21 claims
- 0587US11282843B2Memory device, SRAM cell, and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 22, 2022·2 cites·20 claims
- 0685US12334489B2Lthc as charging barrier in info package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 17, 2025·0 cites·20 claims
- 0785US6493902B2Automatic wall cleansing apparatusFiled 2001·Granted Dec 17, 2002·30 cites·16 claims
- 0884US12073165B2Standard cell designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 27, 2024·1 cites·20 claims
- 0984US8492263B2Protected solder ball joints in wafer level chip-scale packagingWANG CHUNG YU·Filed 2007·Granted Jul 23, 2013·11 cites·13 claims
- 1083US12083284B2Respiratory systemAPEX MEDICAL CORP·Filed 2020·Granted Sep 10, 2024·2 cites·20 claims
- 1182US12051634B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 30, 2024·0 cites·20 claims
- 1282US9309705B2Dual-shaft synchronous transmission fixing deviceFIRST DOME CORP·Filed 2014·Granted Apr 12, 2016·12 cites·40 claims
- 1382US9118255B2Flyback power converter and electronic apparatusLITE ON TECHNOLOGY CORP·Filed 2013·Granted Aug 25, 2015·8 cites·26 claims
- 1481US9136211B2Protected solder ball joints in wafer level chip-scale packagingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·5 cites·19 claims
- 1580US10573573B2Package and package-on-package structure having elliptical conductive columnsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 25, 2020·2 cites·20 claims
- 1680US7361986B2Heat stud for stacked chip packageTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Apr 22, 2008·28 cites·14 claims
- 1780US7116002B2Overhang support for a stacked semiconductor device, and method of forming thereofTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Oct 3, 2006·34 cites·6 claims
- 1878US11923353B2LTHC as charging barrier in info package formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 5, 2024·0 cites·20 claims
- 1977US12507491B2Storage node light shield for pixel of image sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 2077US2025343174A1Seal Ring Structure and Method of Fabricating the SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2176US11756849B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·0 cites·17 claims
- 2276US9462713B2Transmission device applied to pivot shaft mechanismFIRST DOME CORP·Filed 2014·Granted Oct 4, 2016·4 cites·28 claims
- 2376US8829653B2Exclusion zone for stress-sensitive circuit designTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 9, 2014·2 cites·19 claims
- 2476US8624346B2Exclusion zone for stress-sensitive circuit designSU CHAO-YUAN·Filed 2006·Granted Jan 7, 2014·4 cites·23 claims
- 2573US9341323B1Light-mixing flashlightNAT UNIV CHUNG CHENG·Filed 2015·Granted May 17, 2016·3 cites·12 claims
- 2673US2024362392A1Standard cell designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2770US11404341B2Package and package-on-package structure having elliptical columns and ellipsoid joint terminalsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·0 cites·18 claims
- 2870US2023386899A1Local interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2969US11864369B2Memory device and SRAM cellTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jan 2, 2024·0 cites·20 claims
- 3068US12438105B2Seal ring structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 7, 2025·0 cites·20 claims
- 3167US11894263B2Local interconnectTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 6, 2024·0 cites·20 claims
- 3267US10164002B2Semiconductor device and layout methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·1 cites·20 claims
- 3367US7716788B2Hinge for a tablet computer extension padSHIN ZU SHING CO LTD·Filed 2007·Granted May 18, 2010·6 cites·8 claims
- 3467US7588963B2Method of forming overhang support for a stacked semiconductor deviceTAIWAN SEMICONDUCTOR MFG·Filed 2006·Granted Sep 15, 2009·4 cites·23 claims
- 3564US11735579B2Electrostatic discharge preventionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 3659US9691749B2Exclusion zone for stress-sensitive circuit designTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jun 27, 2017·0 cites·20 claims
- 3758US11688654B2Test line structure, semiconductor structure and method for forming test line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·20 claims
- 3858US2025218940A1Semiconductor structure and method of fabricating a semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3956US11690223B23D memory device and manufacturing method thereofMACRONIX INT CO LTD·Filed 2021·Granted Jun 27, 2023·0 cites·9 claims
- 4055US9678541B2Pivot shaft transmission deviceFIRST DOME CORP·Filed 2014·Granted Jun 13, 2017·2 cites·36 claims
- 4155US7792326B2Method of tracking vocal targetCOMPAL ELECTRONICS INC·Filed 2007·Granted Sep 7, 2010·2 cites·10 claims
- 4255US2025330100A1Power supply unit for improved low-load efficiencyDELL PRODUCTS LP·Filed 2024·Application pending·0 cites
- 4353US2022415713A1Metal Interconnects And Method Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 4453US2010269296A1HingeHON HAI PREC IND CO LTD·Filed 2009·Application pending·0 cites
- 4553US2011005034A1HingeHON HAI PREC IND CO LTD·Filed 2009·Application pending·0 cites
- 4650US2009084923A1Adjustable Multi-function Support AssemblyLIN CHUNG-YI·Filed 2007·Application pending·0 cites
- 4749US2009056073A1HingeSHIN ZU SHING CO LTD·Filed 2007·Application pending·0 cites
- 4848US7138300B2Structural design for flip-chip assemblyTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Nov 21, 2006·3 cites·12 claims
- 4948US2010000049A1Interference assembly, hinge utilizing the same, and collapsible device utilizing the hingeHON HAI PREC IND CO LTD·Filed 2008·Application pending·0 cites
- 5046US11036911B2Charging prevention method and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·0 cites·20 claims
Showing the top 50 of 58 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →