Inventor · disambiguated record

Chi-Pu Lin

Also filed as: LIN CHI-PU

0 granted patents·2 pending applications·0 citations·filing 2022–2025

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG CO LTD2

Top patents by PatentIndex Score

2 records

0174US2025316573A1Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
0263US2023307338A1Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →