Inventor · disambiguated record
Chen-Hsien Lin
Also filed as: LIN CHEN-HSIEN
1 granted patent·15 pending applications·2 citations·filing 2020–2025
20Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD16
Top patents by PatentIndex Score
16 records- 0185US11335716B2Photosensing pixel, image sensor and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·7 claims
- 0282US2025366228A1Semiconductor device and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0374US2025338662A1Two layer pixel structure for high resolution with high dynamic rangeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0472US2025336773A1Through substrate via landing on front end of line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0569US2025275282A1Two layer pixel structure for high resolution with high dynamic rangeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0664US2024379500A1Through substrate via landing on front end of line structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0764US2024038818A1Semiconductor device and methods of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 0858US2025294905A1Image sensors and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0955US2025063834A1Full backside deep trench isolation structure for a semiconductor pixel sensor arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1054US2024429129A1Semiconductor device and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1154US2025015124A1Metal-insulator-metal capacitorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1253US2025014987A1Integrated chip including through-substrate via (tsv) and landing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1351US2024194716A1Tapered backside ground structure for pixel arrayTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1451US2024021636A1Optical structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1549US2024055462A1Image sensor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 1649US2025029894A1Dual via structure for through-chip connectionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →