Inventor · disambiguated record
Chen-Hua Lin
Also filed as: LIN CHEN · LIN CHEN-HUA
53 granted patents·14 pending applications·289 citations·filing 1999–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD36NANODYNAMICS INC6WISERTEK INTERNAT CORP6UNIV NAT CENTRAL5LO MEN-TZUNG2
Top patents by PatentIndex Score
67 records- 0198US10741537B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 11, 2020·36 cites·20 claims
- 0297US10269586B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·43 cites·20 claims
- 0396US8970023B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 3, 2015·30 cites·20 claims
- 0494US11769698B2Method of testing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·2 cites·20 claims
- 0594US10937858B2Method for manufacturing semiconductor and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 0692US11804433B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·2 cites·20 claims
- 0792US11626343B2Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 11, 2023·6 cites·20 claims
- 0891US11335672B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 17, 2022·2 cites·20 claims
- 0990US11088037B2Semiconductor device having probe pads and seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·6 cites·20 claims
- 1085US12322742B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 3, 2025·0 cites·20 claims
- 1185US11721597B2Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·1 cites·20 claims
- 1285US2025266417A1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1381US12243788B2Method of testing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1481US10347548B2Integrated circuit package structure and testing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 9, 2019·3 cites·20 claims
- 1580US9433365B1System and method for indentifying rotors in fractionated signals in persistent atrial fibrillation ablationNAT YANG-MING UNIV·Filed 2014·Granted Sep 6, 2016·19 cites·4 claims
- 1680US2025087553A1Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1779US11855066B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1878US2024312851A1Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1977US11993512B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 2077US8862213B2System and method for improved complex fractionated electrogram ablationLO MEN-TZUNG·Filed 2012·Granted Oct 14, 2014·15 cites·11 claims
- 2177US6701593B2Process for producing inkjet printheadNANODYNAMICS INC·Filed 2001·Granted Mar 9, 2004·18 cites·20 claims
- 2275US12183655B2Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 2375US12027433B2Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 2474US11908884B2Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·13 claims
- 2573US11274037B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 2673US6383335B1Heat bonding apparatus for manufacturing an ink-jet printheadWISERTEK INTERNAT CORP·Filed 2000·Granted May 7, 2002·11 cites·9 claims
- 2773US2023387182A1Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2873US2025174499A1Method of testing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2971US2024047310A1Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3070US11776919B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 3170US6682177B2Ink supply structure for inkjet printheadNANODYNAMICS INC·Filed 2002·Granted Jan 27, 2004·11 cites·6 claims
- 3269US11482461B2Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 3368US11322576B2Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 3468US6302526B1Electrode type print head for printing apparatus and method of manufacturing the sameWISERTEK INTERNAT CORP·Filed 2000·Granted Oct 16, 2001·14 cites·8 claims
- 3566US11854913B2Method for detecting defects in semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 3664US9545210B2Accurately indetifying critcal regions in atrial fibrillation by identifying rotors in directional similarity vector fieldLIN YENN-JIANG·Filed 2015·Granted Jan 17, 2017·3 cites·13 claims
- 3763US10500085B2Bed set for inhibition obstructive sleep apneaUNIV NAT CENTRAL·Filed 2016·Granted Dec 10, 2019·2 cites·13 claims
- 3862US9380948B1System and method for quantitative analysis of respiratory sinus arrhythmiaLO MEN-TZUNG·Filed 2013·Granted Jul 5, 2016·3 cites·19 claims
- 3961US12406513B2Automatic scoring method and system to output a test score based on a comparison of a current test paper image and a reference test paper image when determining a script color is a designated script colorAVER INFORMATION INC·Filed 2023·Granted Sep 2, 2025·0 cites·8 claims
- 4061US11450626B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 4160US10629673B2Method for manufacturing semiconductor and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
- 4260US6857186B2Method of manufacturing a piezoelectric print-headNANODYNAMICS INC·Filed 2003·Granted Feb 22, 2005·8 cites·16 claims
- 4360US6345885B1Ink-jet printhead and manufacturing processWISERTEK INTERNAT CORP·Filed 2000·Granted Feb 12, 2002·8 cites·11 claims
- 4459US9259167B2Method and system for extracting ventricular fibrillation signals in electrocardiogramUNIV NAT CENTRAL·Filed 2014·Granted Feb 16, 2016·2 cites·18 claims
- 4558US9061887B2Moisture-resistant packageLIN CHEN HUA·Filed 2012·Granted Jun 23, 2015·1 cites·19 claims
- 4658US6322182B1Method and apparatus of identifying ink stored in an ink-jet cartridgeWISERTEK INTERNAT CORP·Filed 1999·Granted Nov 27, 2001·18 cites·24 claims
- 4757US10699977B2Method of detecting delamination in an integrated circuit package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 4855US2022376034A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 4954US11837526B2Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 5, 2023·0 cites·20 claims
- 5054US6702429B2Ink chamber structure for an inkjet printheadNANODYNAMICS INC·Filed 2002·Granted Mar 9, 2004·5 cites·12 claims
Showing the top 50 of 67 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →