Inventor · disambiguated record
Chi Chih Lin
Also filed as: LIN CHI C · LIN CHI-CHIH
4 granted patents·9 pending applications·48 citations·filing 2007–2024
74Inventor score
Top patents by PatentIndex Score
13 records- 0185US8074112B1Memory backup used in a raid systemCHANG LIHAN·Filed 2008·Granted Dec 6, 2011·28 cites·15 claims
- 0274US2025072496A1Environment-friendly cartridgeKING DEEM ENTPR CO LTD·Filed 2024·Application pending·0 cites
- 0373US8072063B2LED lamp module and fabrication method thereofCHUANG BILL·Filed 2009·Granted Dec 6, 2011·12 cites·17 claims
- 0468US8013434B2Thin double-sided package substrate and manufacture method thereofLIGHT OCEAN TECHNOLOGY CORP·Filed 2008·Granted Sep 6, 2011·8 cites·10 claims
- 0564US12473117B2Composite trayAUO CORP·Filed 2023·Granted Nov 18, 2025·0 cites·13 claims
- 0638US2008135939A1Fabrication method of semiconductor package and structure thereofLIN CHI CHIH·Filed 2007·Application pending·0 cites
- 0737US2008182360A1Fabrication method of semiconductor packageLIN CHI CHIH·Filed 2007·Application pending·0 cites
- 0834US2008217759A1Chip package substrate and structure thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
- 0934US2007194430A1Substrate of chip package and chip package structure thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
- 1033US2009294952A1Chip package carrier and fabrication method thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2008·Application pending·0 cites
- 1132US2011316016A1Led chip package structureLIN CHI CHIH·Filed 2011·Application pending·0 cites
- 1231US2007228541A1Method for fabricating chip package structureTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2007·Application pending·0 cites
- 1329US2010301365A1Light emitting diode module and manufacture method thereofTAIWAN SOLUTIONS SYSTEMS CORP·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →