Inventor · disambiguated record
Chun-Chien Lin
Also filed as: LIN CHUN-CHIEN
1 granted patent·1 pending application·16 citations·filing 2004–2024
38Inventor score
Top patents by PatentIndex Score
2 records- 0174US2024350289A1Thermally stable copper-alloy adhesion layer for metal interconnect structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0259US6946698B1MRAM device having low-k inter-metal dielectricTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Sep 20, 2005·16 cites·10 claims
Join the waitlist — get patent alerts
Get an alert when Chun-Chien Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →