Inventor · disambiguated record
Chia-Chia Lin
Also filed as: LIN CHIA-CHIA
7 granted patents·5 pending applications·21 citations·filing 2014–2025
79Inventor score
Top patents by PatentIndex Score
12 records- 0195US11450628B2Package structure including a solenoid inductor laterally aside a die and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·4 cites·20 claims
- 0294US12021047B2Semiconductor packages having a die, an encapsulant, and a redistribution structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 25, 2024·2 cites·20 claims
- 0394US11315891B2Methods of forming semiconductor packages having a die with an encapsulantTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 26, 2022·11 cites·20 claims
- 0477US2025334737A1Photon source and optical computing architectureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0571US12504588B2Semiconductor device and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 23, 2025·0 cites·20 claims
- 0671US10331254B2Touch organic light-emitting diode display device and touch deviceCORETRONIC CORP·Filed 2017·Granted Jun 25, 2019·2 cites·14 claims
- 0766US10483938B2Tunable filterUNIV NAT TAIWAN·Filed 2018·Granted Nov 19, 2019·2 cites·6 claims
- 0856US2024355771A1Chip package structure with substrates and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 0954US2024387489A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1053US2024387329A1Package structure with optical elements and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1153US2024393653A1Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1234US9696828B2Touch moduleCHU YU-HAN·Filed 2014·Granted Jul 4, 2017·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →