Inventor · disambiguated record
Chief Lin
Also filed as: LIN CHIEF
3 granted patents·6 pending applications·3 citations·filing 2001–2005
54Inventor score
Top patents by PatentIndex Score
9 records- 0137US6501187B1Semiconductor package structure having central leads and method for packaging the sameFiled 2001·Granted Dec 31, 2002·1 cites·8 claims
- 0236US8314481B2Substrate structure for an image sensor package and method for manufacturing the sameHSIN CHUNG HSIEN·Filed 2005·Granted Nov 20, 2012·0 cites·6 claims
- 0332US6642554B2Memory module structureKINGPAK TECH INC·Filed 2001·Granted Nov 4, 2003·2 cites·8 claims
- 0428US2006263460A1Jig structure for manufacturing an image sensorLIN CHIEF·Filed 2005·Application pending·0 cites
- 0526US2002096761A1Structure of stacked integrated circuits and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 0626US2002096762A1Structure of stacked integrated circuits and method for manufacturing the sameFiled 2001·Application pending·0 cites
- 0724US2003068580A1Ceramic shadow-mask in IC process flowFiled 2001·Application pending·0 cites
- 0823US2003068892A1Metal shadow-mask in IC process flowFiled 2001·Application pending·0 cites
- 0921US2003118680A1Jig structure for an integrated circuit packageFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →