Inventor · disambiguated record
Chengchung Lin
Also filed as: LIN CHENGCHUNG
66 granted patents·24 pending applications·25 citations·filing 2016–2023
97Inventor score
Files withSJ SEMICONDUCTOR JIANGYIN CORP90
Top patents by PatentIndex Score
90 records- 0186US11228089B2Antenna packaging module and making method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Jan 18, 2022·2 cites·18 claims
- 0285US11316252B2Antenna packaging structure and method for forming the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Apr 26, 2022·2 cites·16 claims
- 0382US11211687B2Method of fabricating a semiconductor structure with an antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Dec 28, 2021·3 cites·5 claims
- 0481US10593641B2Package method and package structure of fan-out chipSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2016·Granted Mar 17, 2020·4 cites·7 claims
- 0579US10553458B2Chip packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2016·Granted Feb 4, 2020·4 cites·12 claims
- 0676US11508675B2Semiconductor package structure having antenna moduleSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Nov 22, 2022·3 cites·10 claims
- 0775US10714435B2Fan-out antenna packaging structure and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Jul 14, 2020·2 cites·11 claims
- 0874US10777876B2Antenna feeder package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Sep 15, 2020·1 cites·4 claims
- 0973US10325786B1Double-sided plastic fan-out package structure having antenna and manufacturing method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Jun 18, 2019·2 cites·9 claims
- 1070US11502392B2Packaging structure and packaging method for antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Nov 15, 2022·0 cites·9 claims
- 1168US11437707B2Antenna feeder package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Sep 6, 2022·0 cites·5 claims
- 1268US10770394B2Fan-out semiconductor packaging structure with antenna module and method making the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2018·Granted Sep 8, 2020·1 cites·15 claims
- 1367US11699840B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Jul 11, 2023·0 cites·10 claims
- 1465US11842976B2Semiconductor package structure with heat sink and method preparing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Dec 12, 2023·0 cites·5 claims
- 1564US11728558B2Semiconductor structure including antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Aug 15, 2023·0 cites·9 claims
- 1664US11605604B2Fan-out antenna packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Mar 14, 2023·0 cites·7 claims
- 1763US11488915B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Nov 1, 2022·0 cites·8 claims
- 1861US11283152B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Mar 22, 2022·0 cites·9 claims
- 1960US11302658B2Fan-out antenna package structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Apr 12, 2022·0 cites·10 claims
- 2060US11289435B2Fan-out antenna packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Mar 29, 2022·0 cites·16 claims
- 2160US10886594B2Packaging structure and packaging method for antennaSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 5, 2021·0 cites·20 claims
- 2259US11257772B2Fan-out antenna packaging structure and preparation method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Feb 22, 2022·0 cites·9 claims
- 2359US2024234235A9Thermally conductive semiconductor packaging structure and method for preparing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2458US2024063029A1Packaging structure having organic interposer layer and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2558US2024088000A1Fan-out system-level packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2658US2024088008A1Fan-out packaging unit used in pop packaging and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2758US2024088002A1System-level fan-out packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2858US2024047326A1Fan-out packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 2957US11488925B2Semiconductor package structure with heat sink and method preparing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Nov 1, 2022·0 cites·9 claims
- 3057US10971467B2Packaging method and package structure of fan-out chipSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2020·Granted Apr 6, 2021·0 cites·13 claims
- 3157US10886243B2Fan-out antenna packaging structure and preparation thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Jan 5, 2021·0 cites·5 claims
- 3257US2025372468A1Method for preparing three-dimensional stacked optoeletronic packaging structureSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3357US2025286341A1Method for preparing optoelectronic integrated semiconductor packaging structureSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3457US2024055416A1Wafer-level packaging structure and method for preparing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3556US10056350B2Fan-out package structure, and manufacturing method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2016·Granted Aug 21, 2018·1 cites·17 claims
- 3656US2023352451A1Three-dimensional fan-out memory pop structure and packaging method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3756US2023352469A1Stacked memory pop structure and packaging method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3856US2023352461A1Three-dimensional fan-out memory package structure and packaging method thereofSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 3956US2023335526A1High-density-interconnection packaging structure and method for preparing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 4056US2023386967A1Wafer packaging system and method for manufacturing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 4156US2023335478A12.5d/3d electronic packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 4256US2023343669A1Electronic packaging structureSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 4356US2023386950A13d fan-out packaging structure of interconnection system with ultra-high density and method for manufacturing the sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 4456US2023386952A1Fan-out wafer-level packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 4556US2023335514A1Fan-out packaging structure and method for manufacturing sameSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2023·Application pending·0 cites
- 4655US2023163114A1Three-dimensional fan-out integrated package structure, packaging method thereof, and wireless headsetSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Application pending·0 cites
- 4754US12482759B2Wafer-level ASIC 3D integrated substrate, packaging device and preparation methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2022·Granted Nov 25, 2025·0 cites·5 claims
- 4854US11894243B2Wafer system-level fan-out packaging structure and manufacturing methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2021·Granted Feb 6, 2024·0 cites·11 claims
- 4954US11211343B2Fan-out antenna packaging structure and packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Dec 28, 2021·0 cites·10 claims
- 5054US11114391B2Antenna package structure and antenna packaging methodSJ SEMICONDUCTOR JIANGYIN CORP·Filed 2019·Granted Sep 7, 2021·0 cites·9 claims
Showing the top 50 of 90 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Chengchung Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →