Inventor · disambiguated record
Chi-Feng Lin
Also filed as: LIN CHI-FENG
29 granted patents·54 pending applications·81 citations·filing 2001–2025
95Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD28DELTA ELECTRONICS INC17LIN CHI-FENG5IND TECH RES INST4MEDIATEK INC4
Top patents by PatentIndex Score
83 records- 0192US11742290B2Interconnect structure and method of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·2 cites·20 claims
- 0287US7619888B2Flat heat column and heat dissipating apparatus thereofDELTA ELECTRONICS INC·Filed 2007·Granted Nov 17, 2009·16 cites·19 claims
- 0385US12469745B2Conductive structures with bottom-less barriers and linersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 11, 2025·1 cites·20 claims
- 0485US8627243B1Methods for optimizing conductor patterns for ECP and CMP in semiconductor processingTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Jan 7, 2014·8 cites·20 claims
- 0581US7322733B2Light guide plate having micro-reflectorsAPPLIED RES LAB NAT CT FOR HIG·Filed 2005·Granted Jan 29, 2008·24 cites·18 claims
- 0680US12237261B2Semiconductor device having a contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 0779US2025357202A1Semiconductor package redistribution structure and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0878US12165975B2Method of forming interconnect structure having a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 10, 2024·0 cites·20 claims
- 0978US2025357337A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1077US11996361B2Method of making a contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 1177US2025364324A1Conductive structures with bottom-less barriers and linersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1277US2025323164A1Semiconductor device structure with barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1377US2025183161A1Method of making semiconductor device having a contact structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1477US2024413087A1Interconnect Structure and Method of Forming ThereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1574US9184134B2Method of manufacturing a semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Nov 10, 2015·3 cites·20 claims
- 1674US8500300B2Optical lens, light-emitting diode optical component and light-emitting diode road lampFANG YU-BIN·Filed 2011·Granted Aug 6, 2013·9 cites·5 claims
- 1774US2024387382A1Low-resistance copper interconnectsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1874US2024379436A1Self-aligned interconnect structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1974US2024387259A1Conductive structures with barriers and liners of varying thicknessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2073US2024379430A1Interconnect structure including graphite and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2172US12341101B2Method for forming a semiconductor structure by diffusing manganese from a seed layer to a barrier layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 24, 2025·0 cites·20 claims
- 2272US11652044B2Contact structure and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted May 16, 2023·0 cites·20 claims
- 2370US12315764B2Conductive structures with barriers and liners of varying thicknessesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 27, 2025·0 cites·20 claims
- 2470US9787434B2Cyclic redundancy check device and methodMEDIATEK INC·Filed 2014·Granted Oct 10, 2017·3 cites·14 claims
- 2569US9695138B1Phenothiazine derivatives and methods of use thereofACENDA PHARMA INC·Filed 2016·Granted Jul 4, 2017·2 cites·27 claims
- 2669US8561674B2Heat dissipation module and heat pipe thereofLIN CHI-FENG·Filed 2008·Granted Oct 22, 2013·4 cites·13 claims
- 2769US2024282628A1Semiconductor package redistribution structure and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2867US9275894B2Method for forming semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Mar 1, 2016·2 cites·19 claims
- 2967US2024321733A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 3065US8201618B2Heat dissipation module and heat column thereofYU MIN-HUI·Filed 2007·Granted Jun 19, 2012·2 cites·12 claims
- 3164US12334397B2Interconnect structure including graphite and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 17, 2025·0 cites·20 claims
- 3262US10622576B2Organic light-emitting diode and white organic light-emitting diodeIND TECH RES INST·Filed 2017·Granted Apr 14, 2020·1 cites·23 claims
- 3361US2023011792A1Self-Aligned Interconnect Structure And Method Of Forming The SameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 3459US2025329675A1Semiconductor device and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3558US2025349674A1Semiconductor die packages and methods of formationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3658US2023263743A1Nanoparticle complex with defined sizesSUNTEC MEDICAL INC·Filed 2023·Application pending·0 cites
- 3757US7861944B2Jets deviceUNIV NAT TAIWAN·Filed 2007·Granted Jan 4, 2011·3 cites·17 claims
- 3855US9628396B2Network device and method for outputting data to bus with data bus width at each cycle by generating end of packet and start of packet at different cyclesMEDIATEK INC·Filed 2014·Granted Apr 18, 2017·0 cites·15 claims
- 3955US2017365790A1Carbazole derivative and organic electroluminescent deviceIND TECH RES INST·Filed 2017·Application pending·0 cites
- 4055US2024304551A1Aluminum structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4153US9998575B2Network device and method for outputting data to bus with data bus width at each cycle by generating end of packet and start of packet at different cyclesMEDIATEK INC·Filed 2017·Granted Jun 12, 2018·0 cites·21 claims
- 4253US2015243902A1Carbazole derivative and organic electroluminescent deviceIND TECH RES INST·Filed 2014·Application pending·0 cites
- 4353US2025167046A1Vias with selected grain distributionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4452US2006108103A1Heat pipe and wick structure thereofDELTA ELECTRONICS INC·Filed 2005·Application pending·0 cites
- 4550US2008245510A1Heat dissipation apparatus, two-phase heat exchange device and manufacturing method thereofDELTA ELECTRONICS INC·Filed 2008·Application pending·0 cites
- 4649US7751679B1Brightness enhancement film and backlight moduleUNIVACCO TECHNOLOGY INC·Filed 2008·Granted Jul 6, 2010·1 cites·14 claims
- 4747US2019173014A1Benzodiazaborole derivatives and organic light-emitting diodes using the sameUNIV YUAN ZE·Filed 2018·Application pending·0 cites
- 4845US9080817B2Method for manufacturing two-phase heat exchange deviceYU MIN-HUI·Filed 2011·Granted Jul 14, 2015·0 cites·6 claims
- 4944US7991924B2Method and system for initializing devicesVIA TECH INC·Filed 2006·Granted Aug 2, 2011·0 cites·11 claims
- 5044US2006000581A1Cylindrical heat pipesDELTA ELECTRONICS INC·Filed 2004·Application pending·0 cites
Showing the top 50 of 83 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →