Inventor · disambiguated record
Chia-Hsiang Lin
Also filed as: LIN CHIA-HSIANG
20 granted patents·15 pending applications·54 citations·filing 2004–2025
92Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD16LITE ON IT CORP4TAIWAN SEMICONDUCTOR MFG3MEDIATEK INC2CHEN KUEI SHUN1
Top patents by PatentIndex Score
35 records- 0193US12322703B2Eccentric via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jun 3, 2025·1 cites·20 claims
- 0293US12218080B2Package structure with reinforced elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 4, 2025·1 cites·20 claims
- 0391US8563231B2Patterning process and materials for lithographyWANG CHIEN-WEI·Filed 2011·Granted Oct 22, 2013·10 cites·22 claims
- 0490US7480865B2Auxiliary operation interface of digital recording and reproducing apparatusLITE ON IT CORP·Filed 2005·Granted Jan 20, 2009·13 cites·13 claims
- 0587US10665473B2Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 26, 2020·5 cites·14 claims
- 0684US11107801B2Multi fan-out package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 31, 2021·3 cites·20 claims
- 0781US2025149469A1Package structure with reinforced elementTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0879US2025266365A1Eccentric via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0979US2025357300A1Interposers including line-on-via and line-in-via interconnect structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1076US11855008B2Stacking via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 1174US2025316573A1Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1273US9583365B2Method of forming interconnects for three dimensional integrated circuitYU CHUN HUI·Filed 2012·Granted Feb 28, 2017·4 cites·18 claims
- 1371US8119992B2System for overlay measurement in semiconductor manufacturingLU HSIAO-TZU·Filed 2009·Granted Feb 21, 2012·2 cites·22 claims
- 1470US12387992B2Package and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 1570US2025038093A1Interposers including line-on-via and line-in-via interconnect structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1669US12094828B2Eccentric via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 17, 2024·0 cites·20 claims
- 1769US11670601B2Stacking via structures for stress reductionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 6, 2023·0 cites·20 claims
- 1869US7582538B2Method of overlay measurement for alignment of patterns in semiconductor manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Sep 1, 2009·2 cites·29 claims
- 1968US11605600B2Package structure with reinforced element and formation method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 14, 2023·0 cites·20 claims
- 2066US11038358B2Charger circuit with battery protection mechanismMEDIATEK INC·Filed 2016·Granted Jun 15, 2021·1 cites·11 claims
- 2166US8917062B2Charging control circuitLU CHIEN-PING·Filed 2012·Granted Dec 23, 2014·4 cites·7 claims
- 2263US11251142B2Method of fabricating package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·20 claims
- 2363US2023307338A1Package structures and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2463US2021305821A1Charger circuit with battery protection mechanismMEDIA TEK INC·Filed 2021·Application pending·0 cites
- 2562US7226873B2Method of improving via filling uniformity in isolated and dense via-pattern regionsTAIWAN SEMICONDUCTOR MFG·Filed 2004·Granted Jun 5, 2007·8 cites·24 claims
- 2652US2024145433A1Integrated circuit package and methodTAIWAN SEMICONDUCTOR MANUFACTURIING CO LTD·Filed 2023·Application pending·0 cites
- 2745US8132503B2Method and apparatus for planarizing gap-filling materialCHEN KUEI-SHUN·Filed 2007·Granted Mar 13, 2012·0 cites·5 claims
- 2844US2006059488A1Task confirmation methodLITE ON IT CORP·Filed 2005·Application pending·0 cites
- 2944US2010127670A1Battery charging system having high charge rateFARADAY TECH CORP·Filed 2008·Application pending·0 cites
- 3043US2006088280A1Remote controller for use with digital recording and reproducing apparatusLITE ON IT CORP·Filed 2005·Application pending·0 cites
- 3143US2006088288A1Auxiliary operation interface of digital recording and reproducing apparatusLITE ON IT CORP·Filed 2005·Application pending·0 cites
- 3242US9973075B2Method for performing adaptive input current control in an electronic device with aid of adaptor management, and associated apparatusMEDIATEK INC·Filed 2016·Granted May 15, 2018·0 cites·20 claims
- 3341US2006211237A1Method and apparatus for planarizing gap-filling materialTAIWAN SEMICONDUCTOR MFG·Filed 2005·Application pending·0 cites
- 3434US2012249085A1Method For Controlling Charging CurrentLIN CHIA-HSIANG·Filed 2011·Application pending·0 cites
- 3534US2012169294A1Circuit and method for power path managementWANG HSUAN-KAI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →