Inventor · disambiguated record
Cheng-Jen Lin
Also filed as: LIN CHENG-JEN
22 granted patents·10 pending applications·149 citations·filing 1998–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD25MITAC INT CORP2CHEN MING-FU1CHEN-SOURCE INC1LIN CHENG JEN1
Top patents by PatentIndex Score
32 records- 0196US11532692B2Process for tuning via profile in dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 20, 2022·4 cites·20 claims
- 0295US11101233B1Semiconductor device and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 24, 2021·4 cites·20 claims
- 0389US11075173B2Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·5 cites·20 claims
- 0483US10910466B2Process for tuning via profile in dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 2, 2021·2 cites·20 claims
- 0583US7006988B2Method of collaboration commerceMITAC INT CORP·Filed 2000·Granted Feb 28, 2006·46 cites·15 claims
- 0683US2024371915A1Process for tuning via profile in dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0780US12136644B2Process for tuning via profile in dielectric materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Nov 5, 2024·0 cites·20 claims
- 0879US10283471B1Micro-connection structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 7, 2019·2 cites·20 claims
- 0977US11961944B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Apr 16, 2024·0 cites·20 claims
- 1077US2024379584A1Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1176US11094655B2Semiconductor structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 17, 2021·2 cites·20 claims
- 1276US6108198AModular computer deviceMITAC INT CORP·Filed 1998·Granted Aug 22, 2000·83 cites·7 claims
- 1376US2024234637A1Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1475US11004685B2Multi-layer structures and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·1 cites·20 claims
- 1574US2025349645A1Manufacturing method of integrated circuit structure and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1670US11569419B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jan 31, 2023·0 cites·20 claims
- 1769US11851321B2Micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 1868US11942445B2Semiconductor device with conductive padTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 26, 2024·0 cites·20 claims
- 1967US11152319B2Micro-connection structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 19, 2021·0 cites·20 claims
- 2064US11742204B2Multi-layer structures and methods of formingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 29, 2023·0 cites·20 claims
- 2162US12230595B2Metal bumps and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 18, 2025·0 cites·20 claims
- 2262US10651142B2Micro-connection structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 12, 2020·0 cites·20 claims
- 2358US2023063726A1Integrated circuit structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 2457US11024593B2Metal bumps and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 1, 2021·0 cites·18 claims
- 2557US2023369049A1Multi-Layer Structures and Methods of FormingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2651US11413576B2Method for treating gasLIN CHENG JEN·Filed 2019·Granted Aug 16, 2022·0 cites·9 claims
- 2747US2025149485A1Metal bumps and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2846US11171085B2Semiconductor device structure with magnetic layer and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Nov 9, 2021·0 cites·20 claims
- 2944US11114879B2Smart charging methodCHEN SOURCE INC·Filed 2019·Granted Sep 7, 2021·0 cites·6 claims
- 3043US2003012343A1Method and device for call-waiting signal to identify tolerant errorsFiled 2001·Application pending·0 cites
- 3141US2005175751A1Method of extracting isoflavon from soybeansFiled 2004·Application pending·0 cites
- 3232US2012116770A1Speech data retrieving and presenting deviceCHEN MING-FU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →