Inventor · disambiguated record
Chun-Jung Lin
Also filed as: LIN CHUN-JUNG
48 granted patents·33 pending applications·778 citations·filing 1996–2025
98Inventor score
Top patents by PatentIndex Score
81 records- 0196US8687412B2Reference cell configuration for sensing resistance states of MRAM bit cellsCHIH YUE-DER·Filed 2012·Granted Apr 1, 2014·39 cites·19 claims
- 0296US8223534B2Raising programming currents of magnetic tunnel junctions using word line overdrive and high-k metal gateCHUNG SHINE·Filed 2010·Granted Jul 17, 2012·35 cites·20 claims
- 0395US5880040AGate dielectric based on oxynitride grown in N2 O and annealed in NOMACRONIX INT CO LTD·Filed 1996·Granted Mar 9, 1999·285 cites·26 claims
- 0494US6576511B2Method for forming nitride read only memoryMACRONIX INT CO LTD·Filed 2001·Granted Jun 10, 2003·148 cites·22 claims
- 0593US8902641B2Adjusting reference resistances in determining MRAM resistance statesCHIH YUE-DER·Filed 2012·Granted Dec 2, 2014·19 cites·19 claims
- 0693US8493776B1MRAM with current-based self-referenced read operationsYU HUNG-CHANG·Filed 2012·Granted Jul 23, 2013·22 cites·18 claims
- 0792US8878318B2Structure and method for a MRAM device with an oxygen absorbing cap layerCHEN CHIH-MING·Filed 2011·Granted Nov 4, 2014·16 cites·20 claims
- 0891US9852785B2Memories with metal-ferroelectric-semiconductor (MFS) transistorsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 26, 2017·12 cites·19 claims
- 0989US7683447B2MRAM device with continuous MTJ tunnel layersTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Mar 23, 2010·22 cites·9 claims
- 1088US9767878B1Semiconductor memory device and method for controlling the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 19, 2017·6 cites·20 claims
- 1186US8964458B2Differential MRAM structure with relatively reversed magnetic tunnel junction elements enabling writing using same polarity currentLIN KAI-CHUN·Filed 2012·Granted Feb 24, 2015·13 cites·17 claims
- 1286US8760255B2Contactless communications using ferromagnetic materialYANG PING-LIN·Filed 2011·Granted Jun 24, 2014·8 cites·21 claims
- 1386US8008702B2Multi-transistor non-volatile memory elementTAIWAN SEMICONDUCTOR MFG·Filed 2008·Granted Aug 30, 2011·12 cites·6 claims
- 1485US8416600B2Reverse connection MTJ cell for STT MRAMLIN CHUN-JUNG·Filed 2009·Granted Apr 9, 2013·21 cites·20 claims
- 1582US8451655B2MRAM cells and circuit for programming the sameCHUNG SHINE·Filed 2012·Granted May 28, 2013·7 cites·19 claims
- 1680US11999352B2Method and system for extracting road data and method and system for controlling self-driving carIND TECH RES INST·Filed 2021·Granted Jun 4, 2024·1 cites·22 claims
- 1780US10665321B2Method for testing MRAM device and test apparatus thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted May 26, 2020·5 cites·20 claims
- 1877US8110881B2MRAM cell structure with a blocking layer for avoiding short circuitsKAO YA-CHEN·Filed 2007·Granted Feb 7, 2012·7 cites·19 claims
- 1974US10058403B1Dental clamping apparatus and operating method thereofCHILIAD BIOMEDICAL TECH CO LTD·Filed 2017·Granted Aug 28, 2018·2 cites·15 claims
- 2072US8111544B2Programming MRAM cells using probability writeCHUNG SHINE·Filed 2009·Granted Feb 7, 2012·6 cites·20 claims
- 2171US9412721B2Contactless communications using ferromagnetic materialTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 9, 2016·2 cites·20 claims
- 2270US5889711AMemory redundancy for high density memoryMACRONIX INT CO LTD·Filed 1997·Granted Mar 30, 1999·29 cites·25 claims
- 2369US8750031B2Test structures, methods of manufacturing thereof, test methods, and MRAM arraysKAO YA-CHEN·Filed 2011·Granted Jun 10, 2014·2 cites·20 claims
- 2466US6440803B1Method of fabricating a mask ROM with raised bit-line on each buried bit-lineMACRONIX INT CO LTD·Filed 2002·Granted Aug 27, 2002·10 cites·20 claims
- 2563US6468869B1Method of fabricating mask read only memoryMACRONIX INT CO LTD·Filed 2001·Granted Oct 22, 2002·9 cites·27 claims
- 2663US2025360155A1Method of treating spinal cord injury and composition for use thereinACADEMIA SINICA·Filed 2023·Application pending·0 cites
- 2761US7834410B2Spin torque transfer magnetic tunnel junction structureTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Nov 16, 2010·4 cites·20 claims
- 2861US2025349767A1Semiconductor package structure with improved die pad and method thereofWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 2959US8270207B2Raising programming current of magnetic tunnel junctions by applying P-sub bias and adjusting threshold voltageCHUNG SHINE·Filed 2010·Granted Sep 18, 2012·2 cites·24 claims
- 3058US6397377B1Method of performing optical proximity corrections of a photo mask pattern by using a computerMACRONIX INT CO LTD·Filed 1999·Granted May 28, 2002·20 cites·10 claims
- 3158US2024421137A1Chip package unit, chip package stack module, and method of manufacturing chip package stack moduleWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 3258US2024321653A1Wafer package for protection of aluminum die pad of die from damages during probe testing processWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 3357US2024266239A1Chip package unit with outer protective layer and method of manufactuirng the sameWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 3457US2024260195A1Embedded dual in-line memory moduleWALTON ADVANCED ENG INC·Filed 2024·Application pending·0 cites
- 3556US9379316B2Method of fabricating a magnetoresistive random access structureTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Jun 28, 2016·1 cites·20 claims
- 3656US8648401B2Domain wall assisted spin torque transfer magnetresistive random access memory structureLAI CHIH-HUANG·Filed 2010·Granted Feb 11, 2014·1 cites·14 claims
- 3756US2024243075A1Chip package with heat dissipation and electromagnetic protectionWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3856US2024162164A1Chip package with metal shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 3955US2024120300A1Chip packageWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4055US2024088057A1Chip package with electromagnetic interference (emi) shielding layer and ground wire and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4155US2024096758A1Chip package having die pad with protective layerWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4255US2024145404A1Chip package with electromagnetic interference shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4354US12512448B2Multi-layer stacked chip packageWALTON ADVANCED ENG INC·Filed 2023·Granted Dec 30, 2025·0 cites·5 claims
- 4454US12482771B2Chip package with higher bearing capacity in wire bondingWALTON ADVANCED ENG INC·Filed 2023·Granted Nov 25, 2025·0 cites·6 claims
- 4554US11587854B2System in packageWALTON ADVANCED ENG INC·Filed 2021·Granted Feb 21, 2023·0 cites·8 claims
- 4654US2024047375A1Chip package with electromagnetic interference shielding layer and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4754US2024063138A1Chip package having four sides provided with electromagnetic interference shielding layers and method of manufacturing the sameWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4854US2025096150A1Anti-electromagnetic interference wafer structureWALTON ADVANCED ENG INC·Filed 2023·Application pending·0 cites
- 4954US2025372562A1Fan-out wafer-level packaging unitWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
- 5054US2025379178A1Module containing fan-out wafer-level packaging (fowlp) unit connected to electronic component by wire bondingWALTON ADVANCED ENG INC·Filed 2025·Application pending·0 cites
Showing the top 50 of 81 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →