Inventor · disambiguated record
Cha-Hsin Lin
Also filed as: LIN CHA-HSIN
23 granted patents·18 pending applications·63 citations·filing 2004–2015
94Inventor score
Top patents by PatentIndex Score
41 records- 0183US7700988B2Metal-insulator-metal capacitorINDUSTRAIL TECHNOLOGY RES INST·Filed 2006·Granted Apr 20, 2010·13 cites·5 claims
- 0283US7683374B2Silicon based photodetectorIND TECH RES INST·Filed 2005·Granted Mar 23, 2010·7 cites·13 claims
- 0379US8445995B2Semiconductor structure with conductive plug in an oxide layerLIN CHA-HSIN·Filed 2011·Granted May 21, 2013·5 cites·5 claims
- 0477US9041163B2Semiconductor structure and manufacturing method thereofIND TECH RES INST·Filed 2013·Granted May 26, 2015·5 cites·25 claims
- 0573US7663177B2Non-volatile memory device and fabricating method thereofIND TECH RES INST·Filed 2005·Granted Feb 16, 2010·6 cites·10 claims
- 0672US8309402B2Method of fabricating oxide material layer with openings attached to device layersLIN CHA-HSIN·Filed 2011·Granted Nov 13, 2012·3 cites·21 claims
- 0771US9368475B2Semiconductor device and manufacturing method thereofIND TECH RES INST·Filed 2015·Granted Jun 14, 2016·2 cites·9 claims
- 0869US8124954B2Conductive bridging random access memory device and method of manufacturing the sameWANG CHING-CHIUN·Filed 2009·Granted Feb 28, 2012·4 cites·15 claims
- 0967US7696509B2Solid state electrolyte memory device and method of fabricating the sameIND TECH RES INST·Filed 2007·Granted Apr 13, 2010·3 cites·19 claims
- 1066US9257322B2Method for manufacturing through substrate via (TSV), structure and control method of TSV capacitanceCHEN ERH-HAO·Filed 2012·Granted Feb 9, 2016·3 cites·16 claims
- 1166US9093312B2Semiconductor device and manufacturing method thereofIND TECH RES INST·Filed 2013·Granted Jul 28, 2015·2 cites·9 claims
- 1266US7347228B2Method of making semiconductor devicesIND TECH RES INST·Filed 2005·Granted Mar 25, 2008·2 cites·15 claims
- 1357US7724499B2Electrolyte transistorIND TECH RES INST·Filed 2008·Granted May 25, 2010·1 cites·19 claims
- 1457US7507653B2Method of fabricating metal compound dots dielectric pieceIND TECH RES INST·Filed 2006·Granted Mar 24, 2009·2 cites·17 claims
- 1556US7371628B2Method for fabricating semiconductor deviceIND TECH RES INST·Filed 2005·Granted May 13, 2008·1 cites·27 claims
- 1655US7880213B2Bottom electrode of metal-insulator-metal capacitorIND TECH RES INST·Filed 2006·Granted Feb 1, 2011·1 cites·6 claims
- 1753US7033899B2Method of making semiconductor devicesIND TECH RES INST·Filed 2004·Granted Apr 25, 2006·3 cites·9 claims
- 1852US9257338B2TSV substrate structure and the stacked assembly thereofIND TECH RES INST·Filed 2015·Granted Feb 9, 2016·0 cites·3 claims
- 1952US2013214390A1Tsv substrate structure and the stacked assembly thereofIND TECH RES INST·Filed 2013·Application pending·0 cites
- 2051US7589373B2Semiconductor deviceIND TECH RES INST·Filed 2009·Granted Sep 15, 2009·0 cites·17 claims
- 2149US2008023782A1Photo sensor and fabrication method thereofIND TECH RES INST·Filed 2007·Application pending·0 cites
- 2248US7498631B2Sensing memory deviceIND TECH RES INST·Filed 2006·Granted Mar 3, 2009·0 cites·19 claims
- 2348US2012322249A1Manufacturing method of semiconductor structureCHEN JUI-CHIN·Filed 2012·Application pending·0 cites
- 2447US2012133030A1Tsv substrate structure and the stacked assembly thereofWANG CHUNG-CHIH·Filed 2010·Application pending·0 cites
- 2545US2012119375A1Semiconductor structure and manufacturing method thereofCHEN JUI-CHIN·Filed 2010·Application pending·0 cites
- 2643US7408170B2Ultraviolet detectorIND TECH RES INST·Filed 2006·Granted Aug 5, 2008·0 cites·18 claims
- 2743US2014238725A1Method of flattening surface of conductive structure and conductive structure with flattened surfaceTECHNOLOGY RES INST IND·Filed 2013·Application pending·0 cites
- 2843US2010164062A1Method of manufacturing through-silicon-via and through-silicon-via structureIND TECH RES INST·Filed 2009·Application pending·0 cites
- 2943US2009124483A1Metal compound dots dielectric pieceIND TECH RES INST·Filed 2009·Application pending·0 cites
- 3042US9257337B2Semiconductor structure and manufacturing method thereofIND TECH RES INST·Filed 2014·Granted Feb 9, 2016·0 cites·12 claims
- 3141US7521305B2Method for fabricating semiconductor deviceIND TECH RES INST·Filed 2005·Granted Apr 21, 2009·0 cites·18 claims
- 3241US2014175614A1Wafer stacking structure and method of manufacturing the sameIND TECH RES INST·Filed 2012·Application pending·0 cites
- 3341US2014175655A1Chip bonding structure and manufacturing method thereofIND TECH RES INST·Filed 2013·Application pending·0 cites
- 3441US2008054394A1Resistance type memory deviceIND TECH RES INST·Filed 2006·Application pending·0 cites
- 3539US2007166917A1Non-volatile memory device and fabricating method thereforIND TECH RES INST·Filed 2006·Application pending·0 cites
- 3637US2014008652A1Through-substrate via structureHSU TZU-CHIEN·Filed 2012·Application pending·0 cites
- 3737US2013270713A1Dual damascene structure having through silicon via and manufacturing method thereofLIAO SUE-CHEN·Filed 2012·Application pending·0 cites
- 3836US2007145525A1Mim capacitor structure and method of manufacturing the sameIND TECH RES INST·Filed 2006·Application pending·0 cites
- 3935US2012127625A1Trench capacitor structures and method of manufacturing the sameWANG CHUNG-CHIH·Filed 2010·Application pending·0 cites
- 4035US2013161825A1Through substrate via structure and method for fabricating the sameHSU TZU-CHIEN·Filed 2011·Application pending·0 cites
- 4132US2008019168A1Memory structure and data writing method thereofLIN CHA-HSIN·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Cha-Hsin Lin files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →