Inventor · disambiguated record
Chih-Wei Lin
Also filed as: LIN CHIH-WEI
287 granted patents·68 pending applications·2,119 citations·filing 2003–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD180QUANTA COMP INC20TAIWAN SEMICONDUCTOR MFG17LIN CHIH-WEI14LUXSENTEK MICROELECTRONICS CORP11
Top patents by PatentIndex Score
355 records- 0199US9899248B2Method of forming semiconductor packages having through package viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 20, 2018·73 cites·20 claims
- 0299US9368460B2Fan-out interconnect structure and method for forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·1k cites·20 claims
- 0398US11848300B2Semiconductor structure including a semiconductor wafer and a surface mount component overhanging a periphery of the semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·4 cites·20 claims
- 0497US12057359B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 6, 2024·2 cites·20 claims
- 0597US11424213B2Semiconductor structure including a first surface mount component and a second surface mount component and method of fabricating the semiconductor structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 23, 2022·4 cites·20 claims
- 0697US11251141B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Feb 15, 2022·4 cites·20 claims
- 0797US10014260B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 3, 2018·14 cites·20 claims
- 0897US9691708B1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jun 27, 2017·26 cites·20 claims
- 0997US8884431B2Packaging methods and structures for semiconductor devicesLIN CHIH-WEI·Filed 2011·Granted Nov 11, 2014·35 cites·20 claims
- 1096US11688725B2Semiconductor packagesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 27, 2023·2 cites·20 claims
- 1196US11177156B2Semiconductor package, manufacturing method of semiconductor device and semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 16, 2021·10 cites·20 claims
- 1296US10566261B2Integrated fan-out packages with embedded heat dissipation structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Feb 18, 2020·11 cites·20 claims
- 1396US10276541B23D package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 30, 2019·12 cites·22 claims
- 1496US10062764B1Semiconductor device having void between gate electrode and sidewall spacer and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2017·Granted Aug 28, 2018·19 cites·10 claims
- 1596US9859229B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·16 cites·20 claims
- 1696US9768048B2Package on-package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 19, 2017·26 cites·20 claims
- 1796US8975741B2Process for forming package-on-package structuresLIN CHIH-WEI·Filed 2011·Granted Mar 10, 2015·21 cites·20 claims
- 1896US8492891B2Cu pillar bump with electrolytic metal sidewall protectionLU WEN-HSIUNG·Filed 2010·Granted Jul 23, 2013·43 cites·20 claims
- 1995US11211780B1Cable pass-through deviceQUANTA COMP INC·Filed 2020·Granted Dec 28, 2021·5 cites·20 claims
- 2095US10636715B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·5 cites·20 claims
- 2195US10032734B2Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 24, 2018·8 cites·20 claims
- 2295US8735273B2Forming wafer-level chip scale package structures with reduced number of seed layersLU WEN-HSIUNG·Filed 2011·Granted May 27, 2014·25 cites·20 claims
- 2395US8659155B2Mechanisms for forming copper pillar bumpsCHENG MING-DA·Filed 2010·Granted Feb 25, 2014·33 cites·25 claims
- 2495US8405199B2Conductive pillar for semiconductor substrate and method of manufactureLU WEN-HSIUNG·Filed 2010·Granted Mar 26, 2013·23 cites·20 claims
- 2595US7655501B2Wafer level package with good CTE performanceADVANCED CHIP ENG TECH INC·Filed 2008·Granted Feb 2, 2010·50 cites·10 claims
- 2694US10867932B2Method for manufacturing package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 15, 2020·3 cites·20 claims
- 2794US9958912B2Two rack unit chassis and low profile tool-less hard drive carrierQUANTA COMP INC·Filed 2016·Granted May 1, 2018·17 cites·19 claims
- 2893US11088124B2Package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 10, 2021·7 cites·20 claims
- 2993US10325853B2Method of forming semiconductor packages having through package viasTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Jun 18, 2019·8 cites·20 claims
- 3093US9865574B2Alignment in the packaging of integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·9 cites·20 claims
- 3192US11637139B2Semiconductor device including light-collimating layer and biometric device using the sameVANGUARD INT SEMICONDUCT CORP·Filed 2022·Granted Apr 25, 2023·2 cites·15 claims
- 3292US11217555B2Aligning bumps in fan-out packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jan 4, 2022·7 cites·20 claims
- 3392US11079814B2Mechanism for securing an add-in module in a computer deviceQUANTA COMP INC·Filed 2020·Granted Aug 3, 2021·3 cites·17 claims
- 3492US9991190B2Packaging with interposer frameHuang hui min·Filed 2012·Granted Jun 5, 2018·14 cites·20 claims
- 3592US9666572B2Process for forming package-on-package structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 30, 2017·6 cites·20 claims
- 3692US9425178B2RDL-first packaging processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·13 cites·20 claims
- 3792US9123763B2Package-on-package (PoP) structure having at least one package comprising one die being disposed in a core material between first and second surfaces of the core materialYU CHEN-HUA·Filed 2011·Granted Sep 1, 2015·13 cites·13 claims
- 3891US12382611B2Modular liquid cooling for multi-node computing systemsQUANTA COMP INC·Filed 2023·Granted Aug 5, 2025·1 cites·20 claims
- 3991US11991853B2Cable clipQUANTA COMP INC·Filed 2022·Granted May 21, 2024·3 cites·16 claims
- 4091US10879192B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 29, 2020·10 cites·13 claims
- 4191US10128193B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Nov 13, 2018·8 cites·20 claims
- 4291US8803234B1High voltage semiconductor device and method for fabricating the sameVANGUARD INT SEMICONDUCT CORP·Filed 2013·Granted Aug 12, 2014·24 cites·15 claims
- 4391US8242011B2Method of forming metal pillarLIM ZHENG-YI·Filed 2011·Granted Aug 14, 2012·23 cites·20 claims
- 4491US7453148B2Structure of dielectric layers in built-up layers of wafer level packageADVANCED CHIP ENG TECH INC·Filed 2006·Granted Nov 18, 2008·32 cites·18 claims
- 4591US6969189B2LED backlight moduleAU OPTRONICS CORP·Filed 2003·Granted Nov 29, 2005·55 cites·9 claims
- 4690US11456226B2Semiconductor package and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 27, 2022·2 cites·20 claims
- 4790US10515900B2Chip package with fan-out structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·3 cites·20 claims
- 4890US10510644B2Package structures and methods for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 4990US8440503B1Methods for performing reflow in bonding processesLIN HSIU-JEN·Filed 2011·Granted May 14, 2013·13 cites·19 claims
- 5090US2025323192A1Semiconductor package system and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
Showing the top 50 of 355 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →