Inventor · disambiguated record
Chih-Wen Lin
Also filed as: LIN CHIH-WEN
27 granted patents·10 pending applications·440 citations·filing 1997–2024
96Inventor score
Files withMACRONIX INT CO LTD19PRIMAX ELECTRONICS LTD7FARADAY TECH CORP4KUO FENG CORP1TAIWAN GREEN POINT ENTPR CO1
Top patents by PatentIndex Score
37 records- 0193US5812368AMonitor viewing angle adjusting assembly having monitor mounted on two supporting arm assemblies via turning limit assembliesKUO FENG CORP·Filed 1997·Granted Sep 22, 1998·165 cites·6 claims
- 0292US7521783B2Ultra thin image sensor package structure and method for fabricationMACRONIX INT CO LTD·Filed 2006·Granted Apr 21, 2009·21 cites·10 claims
- 0391US7217995B2Apparatus for stacking electrical components using insulated and interconnecting viaMACRONIX INT CO LTD·Filed 2005·Granted May 15, 2007·20 cites·22 claims
- 0490US11206378B2Camera module aligning methodPRIMAX ELECTRONICS LTD·Filed 2020·Granted Dec 21, 2021·3 cites·8 claims
- 0590US7227253B2Ultra thin dual chip image sensor package structure and method for fabricationMACRONIX INT CO LTD·Filed 2006·Granted Jun 5, 2007·16 cites·15 claims
- 0688US6650008B2Stacked semiconductor packaging deviceMACRONIX INT CO LTD·Filed 2002·Granted Nov 18, 2003·54 cites·25 claims
- 0787US6559526B2Multiple-step inner lead of leadframeMACRONIX INT CO LTD·Filed 2001·Granted May 6, 2003·52 cites·14 claims
- 0886US11900743B2Security authentication method and security authentication device using samePRIMAX ELECTRONICS LTD·Filed 2022·Granted Feb 13, 2024·1 cites·16 claims
- 0976US6972372B1Method and apparatus for stacking electrical components using outer lead portions and exposed inner lead portions to provide interconnectionMACRONIX INT CO LTD·Filed 2004·Granted Dec 6, 2005·23 cites·21 claims
- 1074US10958817B1Method for determining camera module assembling qualityPRIMAX ELECTRONICS LTD·Filed 2020·Granted Mar 23, 2021·1 cites·10 claims
- 1174US7495327B2Chip stacking structureMACRONIX INT CO LTD·Filed 2006·Granted Feb 24, 2009·5 cites·19 claims
- 1274US7045888B2Ultra thin dual chip image sensor package structure and method for fabricationMACRONIX INT CO LTD·Filed 2004·Granted May 16, 2006·16 cites·7 claims
- 1372US7259042B2Ultra thin dual chip image sensor package structure and method for fabricationMACRONIX INT CO LTD·Filed 2006·Granted Aug 21, 2007·4 cites·13 claims
- 1471US7231565B2Method for performing built-in and at-speed test in system-on-chipFARADAY TECH CORP·Filed 2005·Granted Jun 12, 2007·6 cites·13 claims
- 1571US7122904B2Semiconductor packaging device and manufacture thereofMACRONIX INT CO LTD·Filed 2002·Granted Oct 17, 2006·16 cites·4 claims
- 1670US2024327614A1Method for manufacturing play-of-color article, play-of-color article, and play-of-color product including the sameTAIWAN GREEN POINT ENTPR CO·Filed 2024·Application pending·0 cites
- 1763US7102159B2Ultra thin image sensor package structure and method for fabricationMACRONIX INT CO LTD·Filed 2004·Granted Sep 5, 2006·8 cites·13 claims
- 1863US7047433B2Method and circuit for synchronizing a higher frequency clock and a lower frequency clockFARADAY TECH CORP·Filed 2003·Granted May 16, 2006·9 cites·12 claims
- 1958US7462925B2Method and apparatus for stacking electrical components using via to provide interconnectionMACRONIX INT CO LTD·Filed 2004·Granted Dec 9, 2008·6 cites·40 claims
- 2058US2025124728A1Food status recognition and display system and food status recognition and display methodPRIMAX ELECTRONICS LTD·Filed 2024·Application pending·0 cites
- 2156US7058557B2Method for functional verification of hardware designFARADAY TECH CORP·Filed 2002·Granted Jun 6, 2006·7 cites·11 claims
- 2255US12249108B23D image sensing device with 3D image processing function and 3D image processing method applied theretoPRIMAX ELECTRONICS LTD·Filed 2023·Granted Mar 11, 2025·0 cites·12 claims
- 2355US7213187B2Digital logic test method to systematically approach functional coverage completely and related apparatus and systemFARADAY TECH CORP·Filed 2005·Granted May 1, 2007·2 cites·13 claims
- 2451US11582395B1Gimbal devicePRIMAX ELECTRONICS LTD·Filed 2021·Granted Feb 14, 2023·0 cites·9 claims
- 2551US7892888B2Method and apparatus for stacking electrical components using via to provide interconnectionMACRONIX INT CO LTD·Filed 2007·Granted Feb 22, 2011·0 cites·7 claims
- 2650US6977436B2Semiconductor packaging deviceMACRONIX INT CO LTD·Filed 2002·Granted Dec 20, 2005·4 cites·23 claims
- 2748US8558357B2Ultra thin image sensor package structure and method for fabricationTSAI CHEN JUNG·Filed 2009·Granted Oct 15, 2013·0 cites·19 claims
- 2847US2007018333A1Semiconductor packaging device and manufacture thereofMACRONIX INT CO LTD·Filed 2006·Application pending·0 cites
- 2946US11509888B1Method for aligning camera lens with light sourcePRIMAX ELECTRONICS LTD·Filed 2021·Granted Nov 22, 2022·0 cites·20 claims
- 3044US7291927B2Dual chips stacked packaging structureMACRONIX INT CO LTD·Filed 2003·Granted Nov 6, 2007·1 cites·23 claims
- 3141US2007052079A1Multi-chip stacking package structureMACRONIX INT CO LTD·Filed 2005·Application pending·0 cites
- 3238US2005012184A1Semiconductor packaging structureFiled 2004·Application pending·0 cites
- 3338US2002180021A1Three-dimension multi-chip stack package technologyMACRONIX INT CO LTD·Filed 2002·Application pending·0 cites
- 3437US2002180020A1Three-dimension multi-chip stack package technologyFiled 2001·Application pending·0 cites
- 3536US2004021230A1Ultra thin stacking packaging deviceMACRONIX INT CO LTD·Filed 2002·Application pending·0 cites
- 3636US2004000703A1Semiconductor package body having a lead frame with enhanced heat dissipationFiled 2002·Application pending·0 cites
- 3731US2004203278A1[signal transmission cable]Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →