Inventor · disambiguated record
Chenting Lin
Also filed as: LIN CHENTING
14 granted patents·3 pending applications·187 citations·filing 1998–2008
93Inventor score
Top patents by PatentIndex Score
17 records- 0183US6459709B1Wavelength-tunable semiconductor laser diodeNOVA CRYSTALS INC·Filed 2001·Granted Oct 1, 2002·30 cites·14 claims
- 0275US6432725B1Methods for crystallizing metallic oxide dielectric films at low temperatureINFINEON TECHNOLOGIES AG·Filed 2001·Granted Aug 13, 2002·17 cites·27 claims
- 0368US6685796B1CMP uniformityINFINEON TECHNOLOGIES AG·Filed 2000·Granted Feb 3, 2004·11 cites·18 claims
- 0467US6339007B1Capacitor stack structure and method of fabricating descriptionIBM·Filed 2000·Granted Jan 15, 2002·15 cites·15 claims
- 0566US6794705B2Multi-layer Pt electrode for DRAM and FRAM with high K dielectric materialsINFINEON TECHNOLOGIES AG·Filed 2000·Granted Sep 21, 2004·10 cites·21 claims
- 0666US6429131B2CMP uniformityINFINEON TECHNOLOGIES AG·Filed 1999·Granted Aug 6, 2002·33 cites·14 claims
- 0760US6281114B1Planarization after metal chemical mechanical polishing in semiconductor wafer fabricationINFINEON TECHNOLOGIES AG·Filed 2000·Granted Aug 28, 2001·9 cites·17 claims
- 0857US6132294AMethod of enhancing semiconductor wafer releaseSIEMENS AG·Filed 1998·Granted Oct 17, 2000·22 cites·20 claims
- 0955US6420267B1Method for forming an integrated barrier/plug for a stacked capacitorINFINEON TECHNOLOGIES AG·Filed 2000·Granted Jul 16, 2002·5 cites·8 claims
- 1055US5972787ACMP process using indicator areas to determine endpointIBM·Filed 1998·Granted Oct 26, 1999·20 cites·7 claims
- 1153US7319270B2Multi-layer electrode and method of forming the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Jan 15, 2008·4 cites·26 claims
- 1249US2008108203A1Multi-Layer Electrode and Method of Forming the SameLIAN JINGYU·Filed 2008·Application pending·0 cites
- 1346US6943113B1Metal chemical polishing process for minimizing dishing during semiconductor wafer fabricationINFINEON TECHNOLOGIES AG·Filed 2000·Granted Sep 13, 2005·3 cites·19 claims
- 1446US6222220B1Extended trench for preventing interaction between components of stacked capacitorsSIEMENS AG·Filed 1998·Granted Apr 24, 2001·8 cites·13 claims
- 1536US6413866B1Method of forming a solute-enriched layer in a substrate surface and article formed therebyIBM·Filed 2000·Granted Jul 2, 2002·0 cites·16 claims
- 1636US2002003824A1Surface-emitting laser devices with integrated beam-shaping optics and power-monitoring detectorsFiled 2001·Application pending·0 cites
- 1735US2005196917A1Method for forming a (111) oriented BSTO thin film layer for high dielectric constant capacitorsFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →