Inventor · disambiguated record

Chiu-Ching Lin

Also filed as: LIN CHIU-CHING

1 granted patent·67 citations·filing 2000–2000

50Inventor score

Technology areasH10W

Files withTAIWAN SEMICONDUCTOR MFG1

Top patents by PatentIndex Score

1 record

0187US6306750B1Bonding pad structure to prevent inter-metal dielectric cracking and to improve bondabilityTAIWAN SEMICONDUCTOR MFG·Filed 2000·Granted Oct 23, 2001·67 cites·17 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →