Inventor · disambiguated record
Chieh-Chun Lin
Also filed as: LIN CHIEH-CHUN
5 granted patents·3 pending applications·0 citations·filing 2019–2025
64Inventor score
Top patents by PatentIndex Score
8 records- 0187US2025346380A1Integrated semiconductor die parceling platformsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0282US12434870B2Integrated semiconductor die parceling platformsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Oct 7, 2025·0 cites·20 claims
- 0381US2025357169A1Wafer transfer system and a method for transporting wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0476US11851224B2Integrated semiconductor die parceling platformsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·9 claims
- 0573US2024387218A1Wafer transfer system and a method for transporting wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0672US12125727B2Wafer transfer system and a method for transporting wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 22, 2024·0 cites·20 claims
- 0763US11299302B2Integrated semiconductor die parceling platformsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 12, 2022·0 cites·20 claims
- 0836US11572884B2Direct current brushless fan and drive apparatusLIU CHIA YUAN·Filed 2020·Granted Feb 7, 2023·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →