Inventor · disambiguated record
Chwen-Ming Liu
Also filed as: LIU CHWEN-MING
33 granted patents·7 pending applications·483 citations·filing 1992–2025
96Inventor score
Top patents by PatentIndex Score
40 records- 0194US11769698B2Method of testing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 26, 2023·2 cites·20 claims
- 0294US10937858B2Method for manufacturing semiconductor and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 0394US6314379B1Integrated defect yield management and query systemTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Nov 6, 2001·173 cites·9 claims
- 0492US11804433B2Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 31, 2023·2 cites·20 claims
- 0592US11626343B2Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 11, 2023·6 cites·20 claims
- 0691US5962867AAbatement of electron beam charging distortion during dimensional measurements of integrated circuit patterns with scanning electron microscopy by the utilization of specially designed test structuresTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Oct 5, 1999·110 cites·21 claims
- 0790US11088037B2Semiconductor device having probe pads and seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·6 cites·20 claims
- 0885US11721597B2Semiconductor device and manufacturing method of the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 8, 2023·1 cites·20 claims
- 0981US12243788B2Method of testing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 4, 2025·0 cites·20 claims
- 1081US10347548B2Integrated circuit package structure and testing method using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 9, 2019·3 cites·20 claims
- 1180US2025087553A1Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1278US2024312851A1Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1377US11993512B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 28, 2024·0 cites·20 claims
- 1477US5393682AMethod of making tapered poly profile for TFT device manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 1993·Granted Feb 28, 1995·42 cites·20 claims
- 1575US12183655B2Semiconductor device with enhanced thermal dissipation and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 31, 2024·0 cites·20 claims
- 1675US12027433B2Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 2, 2024·0 cites·20 claims
- 1774US11908884B2Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·13 claims
- 1873US11274037B2Dual micro-electro mechanical system and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 15, 2022·0 cites·20 claims
- 1973US5736863AAbatement of electron beam charging distortion during dimensional measurements of integrated circuit patterns with scanning electron microscopy by the utilization of specially designed test structuresTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted Apr 7, 1998·38 cites·10 claims
- 2073US2023387182A1Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2173US2025174499A1Method of testing semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2271US2024047310A1Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 2370US11776919B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 3, 2023·0 cites·20 claims
- 2469US11482461B2Semiconductor package and method for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 25, 2022·0 cites·20 claims
- 2569US5254497AMethod of eliminating degradation of a multilayer metallurgy/insulator structure of a VLSI integrated circuitTAIWAN SEMICONDUCTOR MFG·Filed 1992·Granted Oct 19, 1993·44 cites·20 claims
- 2668US11322576B2Inductive deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·0 cites·20 claims
- 2766US11854913B2Method for detecting defects in semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2861US11450626B2Semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 20, 2022·0 cites·20 claims
- 2960US10629673B2Method for manufacturing semiconductor and structure thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 21, 2020·0 cites·20 claims
- 3057US10699977B2Method of detecting delamination in an integrated circuit package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 30, 2020·0 cites·20 claims
- 3156US2025294797A1Semiconductor device and methods for forming the sameVANGUARD INT SEMICONDUCT CORP·Filed 2024·Application pending·0 cites
- 3255US2022376034A1Semiconductor package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Application pending·0 cites
- 3354US11837526B2Semiconductor package structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 5, 2023·0 cites·20 claims
- 3451US6005277AARC layer enhancement for reducing metal loss during via etchTAIWAN SEMICONDUCTOR MFG·Filed 1998·Granted Dec 21, 1999·18 cites·1 claims
- 3549US10937772B2Semiconductor package and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·0 cites·20 claims
- 3647US5514617AMethod of making a variable resistance polysilicon conductor for an SRAM deviceTAIWAN SEMICONDUCTOR MFG·Filed 1994·Granted May 7, 1996·10 cites·12 claims
- 3744US5834346AProcedure for eliminating bubbles formed during reflow of a dielectric layer over an LDD structureTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Nov 10, 1998·12 cites·17 claims
- 3838US5646057AMethod for a MOS device manufacturingTAIWAN SEMICONDUCTOR MFG·Filed 1995·Granted Jul 8, 1997·7 cites·7 claims
- 3933US6248624B1Method for forming a dram stacked capacitor of zig-zag configurationTAIWAN SEMICONDUCTOR MFG·Filed 1997·Granted Jun 19, 2001·4 cites·28 claims
- 4031US5757053AEffective load length increase by topographyTAIWAN SEMICONDUCTOR MFG·Filed 1996·Granted May 26, 1998·2 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →