Inventor · disambiguated record
Chia-Hung Liu
Also filed as: LIU CHIA-HUNG
71 granted patents·26 pending applications·262 citations·filing 2000–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD39DARFON ELECTRONICS CORP23LIU CHIA-HUNG8DARFON ELECTRONICS SUZHOU CO LTD5IND TECH RES INST4
Top patents by PatentIndex Score
97 records- 0198US12113022B2Semiconductor package and manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 8, 2024·6 cites·20 claims
- 0297US10431402B2Button switch with adjustable tactile feedbackDARFON ELECTRONICS CORP·Filed 2018·Granted Oct 1, 2019·19 cites·24 claims
- 0396US10310609B2Keyswitch with adjustable tactile feedbackDARFON ELECTRONICS CORP·Filed 2017·Granted Jun 4, 2019·9 cites·24 claims
- 0496US9941070B2Keyswitch structure mounted within a circuit board and baseplateDARFON ELECTRONICS SUZHOU CO LTD·Filed 2017·Granted Apr 10, 2018·9 cites·20 claims
- 0595US11469474B2Battery assemblyDARFON ELECTRONICS CORP·Filed 2020·Granted Oct 11, 2022·5 cites·20 claims
- 0695US11223357B2KeyswitchDARFON ELECTRONICS CORP·Filed 2020·Granted Jan 11, 2022·6 cites·22 claims
- 0795US11004786B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 11, 2021·10 cites·20 claims
- 0894US11929318B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 12, 2024·2 cites·20 claims
- 0994US10074615B1Package structure and method of fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 11, 2018·10 cites·20 claims
- 1093US12002768B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 4, 2024·2 cites·20 claims
- 1193US11374136B2Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 28, 2022·3 cites·20 claims
- 1293US7540675B2Foldable keyboardDARFON ELECTRONICS CORP·Filed 2006·Granted Jun 2, 2009·27 cites·10 claims
- 1392US11756872B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·2 cites·20 claims
- 1492US11735380B2Keyswitch structure and keyboardDARFON ELECTRONICS CORP·Filed 2022·Granted Aug 22, 2023·1 cites·18 claims
- 1590US12068212B2Package structure with through via extending through redistribution layer and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 20, 2024·1 cites·20 claims
- 1690US11108393B2Optical keyswitch triggered by support mechanism having at least one rotatable frame enable a protrusion to move along with a key capDARFON ELECTRONICS CORP·Filed 2019·Granted Aug 31, 2021·7 cites·17 claims
- 1790US10510631B2Fan out package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·5 cites·20 claims
- 1889US10930451B2Keyswitch with adjustable tactile feedbackDARFON ELECTRONICS CORP·Filed 2019·Granted Feb 23, 2021·4 cites·22 claims
- 1988US10637470B2Optical keyswitchDARFON ELECTRONICS CORP·Filed 2019·Granted Apr 28, 2020·6 cites·22 claims
- 2087US11916025B2Device die and method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 27, 2024·1 cites·20 claims
- 2187US10572018B2Keyswitch with adjustable tactile feedbackDARFON ELECTRONICS CORP·Filed 2018·Granted Feb 25, 2020·4 cites·9 claims
- 2286US12362274B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 2386US10762319B2Fingerprint sensor and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·3 cites·20 claims
- 2486US2025357384A1Method for fabricating device dieTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2585US10128063B2KeyswitchDARFON ELECTRONICS SUZHOU CO LTD·Filed 2018·Granted Nov 13, 2018·3 cites·21 claims
- 2685US8882055B2Collapsible cable management armECHOSTREAMS INNOVATIVE SOLUTIONS·Filed 2012·Granted Nov 11, 2014·10 cites·18 claims
- 2785US2025273565A1Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2884US10211006B2Illuminated keyswitchDARFON ELECTRONICS SUZHOU CO LTD·Filed 2017·Granted Feb 19, 2019·3 cites·14 claims
- 2984US10079601B2Keyswitch with adjustable tactile feedback and switch thereofDARFON ELECTRONICS CORP·Filed 2017·Granted Sep 18, 2018·4 cites·44 claims
- 3083US12381163B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Aug 5, 2025·0 cites·20 claims
- 3183US12334434B2Package structure and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 3283US2024363464A1Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3382US11056412B2Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 6, 2021·2 cites·20 claims
- 3481US10629972B2Radio-frequency switching circuitPEGATRON CORP·Filed 2018·Granted Apr 21, 2020·5 cites·10 claims
- 3581US8217289B2Keyboard and key structure thereofLIU CHIA-HUNG·Filed 2008·Granted Jul 10, 2012·11 cites·16 claims
- 3681US2024384406A1Semiconductor process chamber with improved reflectorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3781US2025316616A1Semiconductor package and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3880US12176279B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Dec 24, 2024·0 cites·20 claims
- 3980USD692432SCasing with foldable keyboardLIU CHIA-HUNG·Filed 2011·Granted Oct 29, 2013·37 cites·1 claims
- 4079US11664438B2Semiconductor structure and method for forming the sameWINBOND ELECTRONICS CORP·Filed 2019·Granted May 30, 2023·2 cites·18 claims
- 4179US10068726B2KeyswitchDARFON ELECTRONICS SUZHOU CO LTD·Filed 2017·Granted Sep 4, 2018·2 cites·16 claims
- 4279US8976520B2Removable hard disk drive holderECHOSTREAMS INNOVATIVE SOLUTIONS·Filed 2012·Granted Mar 10, 2015·8 cites·8 claims
- 4379US8347644B2Air conditioning systemIND TECH RES INST·Filed 2009·Granted Jan 8, 2013·8 cites·14 claims
- 4479US2024371776A1Manufacturing method of semiconductor packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4579US2025087571A1Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4677US11309225B2Fan-out package structure and method of manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 19, 2022·1 cites·20 claims
- 4776US11847852B2Manufacturing method of fingerprint sensorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 19, 2023·0 cites·20 claims
- 4876US11018667B2Optical keyswitchDARFON ELECTRONICS CORP·Filed 2019·Granted May 25, 2021·2 cites·19 claims
- 4976US2024088307A1Semiconductor package and forming method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 5075US7153050B2Collapsible keyboardDARFON ELECTRONICS CORP·Filed 2005·Granted Dec 26, 2006·8 cites·14 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →