Inventor · disambiguated record
Chien Liu
Also filed as: LIU CHIEN · LIU CHIEN-YEH
19 granted patents·8 pending applications·205 citations·filing 2004–2015
94Inventor score
Top patents by PatentIndex Score
27 records- 0189US9397074B1Semiconductor device package and method of manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Jul 19, 2016·9 cites·14 claims
- 0289US6967403B2Package structure with a heat spreader and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Nov 22, 2005·72 cites·14 claims
- 0387US9653415B2Semiconductor device packages and method of making the sameADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted May 16, 2017·7 cites·16 claims
- 0486US7368806B2Flip chip package with anti-floating structureADVANCED SEMICONDUCTOR ENG·Filed 2005·Granted May 6, 2008·18 cites·8 claims
- 0583US7425468B2Method for making flip chip on leadframe packageADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Sep 16, 2008·16 cites·13 claims
- 0682US7834469B2Stacked type chip package structure including a chip package and a chip that are stacked on a lead frameADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Nov 16, 2010·12 cites·18 claims
- 0776US7253508B2Semiconductor package with a flip chip on a solder-resist leadframeADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Aug 7, 2007·24 cites·14 claims
- 0874US7902650B2Semiconductor package and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Mar 8, 2011·7 cites·19 claims
- 0971US7164202B2Quad flat flip chip package and leadframe thereofADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jan 16, 2007·17 cites·13 claims
- 1066US9148097B2Electronic system—radio frequency power amplifier and method for dynamic adjusting bias pointADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted Sep 29, 2015·3 cites·8 claims
- 1166US8384204B2Circuit carrier and semiconductor package using the sameADVANCED SEMICONDUCTOR ENG·Filed 2010·Granted Feb 26, 2013·1 cites·15 claims
- 1264US7067904B2Flip-chip type quad flat package and leadframeADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Jun 27, 2006·11 cites·12 claims
- 1362US7816773B2Package structure and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Oct 19, 2010·2 cites·1 claims
- 1461US9166530B2Low noise amplifier and receiverADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Oct 20, 2015·2 cites·12 claims
- 1552US9024689B2Electronic system—radio frequency power amplifier and method for self-adjusting bias pointADVANCED SEMICONDUCTOR ENG·Filed 2013·Granted May 5, 2015·1 cites·9 claims
- 1650US8766654B2Package structure with conformal shielding and inspection method using the sameDING JAW-MING·Filed 2012·Granted Jul 1, 2014·1 cites·4 claims
- 1746US9123981B1Tunable radio frequency coupler and manufacturing method thereofADVANCED SEMICONDUCTOR ENG·Filed 2014·Granted Sep 1, 2015·0 cites·12 claims
- 1846US7022551B2Quad flat flip chip packaging process and leadframe thereforADVANCED SEMICONDUCTOR ENG·Filed 2004·Granted Apr 4, 2006·2 cites·12 claims
- 1946US2008179739A1Flip chip package with anti-floating structureADVANCED SEMICONDUCTOR ENG·Filed 2008·Application pending·0 cites
- 2045US2009278243A1Stacked type chip package structure and method for fabricating the sameADVANCED SEMICONDUCTOR ENG·Filed 2009·Application pending·0 cites
- 2143US2006051894A1Method for bonding flip chip on leadframeADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 2243US2007166881A1Package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2006·Application pending·0 cites
- 2342US2006244115A1Chip package structure and method for manufacturing the sameADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 2441US2007108626A1Flip-chip integrated circuit packaging methodLIU CHIEN·Filed 2006·Application pending·0 cites
- 2541US2006105502A1Assembly processADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
- 2638US10157855B2Semiconductor device including electric and magnetic field shieldingADVANCED SEMICONDUCTOR ENG·Filed 2015·Granted Dec 18, 2018·0 cites·18 claims
- 2737US2006084199A1Processing method during a package processADVANCED SEMICONDUCTOR ENG·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →