Inventor · disambiguated record
Ching-Yu Lo
Also filed as: LO CHING YU · LO CHING YU CONRAD
12 granted patents·2 pending applications·348 citations·filing 2002–2024
91Inventor score
Top patents by PatentIndex Score
14 records- 0197US9026526B1Providing images of named resources in response to a search queryGOOGLE INC·Filed 2013·Granted May 5, 2015·249 cites·20 claims
- 0292US9411827B1Providing images of named resources in response to a search queryGOOGLE INC·Filed 2015·Granted Aug 9, 2016·9 cites·20 claims
- 0390US8538943B1Providing images of named resources in response to a search queryBAU DAVID·Filed 2008·Granted Sep 17, 2013·21 cites·13 claims
- 0489US8264066B2Liner formation in 3DIC structuresLO CHING-YU·Filed 2009·Granted Sep 11, 2012·14 cites·13 claims
- 0588US9189554B1Providing images of named resources in response to a search queryGOOGLE INC·Filed 2015·Granted Nov 17, 2015·5 cites·18 claims
- 0680US6928617B2Segmentation of views for simplified navigation on limited deviceIBM·Filed 2002·Granted Aug 9, 2005·25 cites·12 claims
- 0775US7761192B2Complex signal processing system and related method for controlling multiple fansTYAN COMPUTER CORP·Filed 2006·Granted Jul 20, 2010·8 cites·17 claims
- 0874US8818833B2Method and system for managing service requests across multiple systemsDRUYAN ALEXANDER·Filed 2002·Granted Aug 26, 2014·12 cites·22 claims
- 0965US8405192B2Low dielectric constant materialHUANG HSIN-YEN·Filed 2010·Granted Mar 26, 2013·2 cites·19 claims
- 1061US8836127B2Interconnect with flexible dielectric layerLO CHING-YU·Filed 2009·Granted Sep 16, 2014·2 cites·20 claims
- 1156US8736014B2High mechanical strength additives for porous ultra low-k materialLIN BO-JIUN·Filed 2008·Granted May 27, 2014·1 cites·16 claims
- 1253US8629066B2Liner formation in 3DIC structuresLO CHING-YU·Filed 2012·Granted Jan 14, 2014·0 cites·18 claims
- 1353US2025088361A1Trusted platform module device for multi-node systemsINTEL CORP·Filed 2024·Application pending·0 cites
- 1450US2024303343A1Partitioning of processor socketsINTEL CORP·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →