Inventor · disambiguated record
Chun Ping Lo
Also filed as: LO CHUN PING
1 granted patent·5 pending applications·0 citations·filing 2021–2025
13Inventor score
Technology areasH10W
Files withTEXAS INSTRUMENTS INC6
Top patents by PatentIndex Score
6 records- 0162US2025201689A1Multilevel package substrate with stair shaped substrate tracesTEXAS INSTRUMENTS INC·Filed 2025·Application pending·0 cites
- 0259US12266597B2Multilevel package substrate with stair shaped substrate tracesTEXAS INSTRUMENTS INC·Filed 2021·Granted Apr 1, 2025·0 cites·20 claims
- 0355US2025372509A1Microelectronic device package with hybrid isolation laminateTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0452US2025183133A1Semiconductor device package with integrated laminate transformerTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
- 0549US2025273535A1Electronic device dual side molded soldermaskless package substrate package for improved thermal dissipation and thermomechanical integrityTEXAS INSTRUMENTS INC·Filed 2024·Application pending·0 cites
- 0647US2023378146A1Microelectronic device package with integral passive componentTEXAS INSTRUMENTS INC·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →