Inventor · disambiguated record
Chih Wei Lu
Also filed as: LU CHIH W · LU CHIH WEI
139 granted patents·50 pending applications·318 citations·filing 1994–2025
99Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD137MICROBASE TECHNOLOGY CORP7TAIWAN SEMICONDUCTOR MFG7APOLLO MEDICAL OPTICS LTD5IND TECH RES INST5
Top patents by PatentIndex Score
189 records- 0198US9633999B1Method and structure for semiconductor mid-end-of-line (MEOL) processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 25, 2017·32 cites·20 claims
- 0297US12046551B2Interconnect structure having a barrier layer along the sidewall of self-aligned via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 23, 2024·2 cites·20 claims
- 0397US11302641B2Self-aligned cavity strucutreTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 12, 2022·4 cites·20 claims
- 0497US11171284B2Memory deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 9, 2021·4 cites·20 claims
- 0597US10937652B1Method and structure of cut end with self-aligned double patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Mar 2, 2021·11 cites·20 claims
- 0697US9312220B2Structure and method for a low-K dielectric with pillar-type air-gapsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Apr 12, 2016·30 cites·25 claims
- 0796US12424488B2Dual etch-stop layer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 23, 2025·2 cites·20 claims
- 0896US11798910B2Self-aligned interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Oct 24, 2023·2 cites·20 claims
- 0996US11631639B2Method of fabricating self-aligned via structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 18, 2023·2 cites·20 claims
- 1095US11942364B2Selective deposition of a protective layer to reduce interconnect structure critical dimensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·2 cites·20 claims
- 1195US11362030B2Sidewall spacer structure enclosing conductive wire sidewalls to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jun 14, 2022·3 cites·20 claims
- 1294US11848207B2Method and structure of cut end with self-aligned double patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 19, 2023·2 cites·20 claims
- 1394US10700264B2Memory device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 30, 2020·4 cites·20 claims
- 1494US10355198B2Memory device and fabrication method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jul 16, 2019·8 cites·20 claims
- 1594US10163887B2Method and structure for semiconductor mid-end-of-line (MEOL) processTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 25, 2018·7 cites·20 claims
- 1693US10818600B2Structure and method for a low-k dielectric with pillar-type air-gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 27, 2020·6 cites·20 claims
- 1793US9633949B2Copper etching integration schemeTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 25, 2017·7 cites·20 claims
- 1892US10636963B2Magnetic tunnel junctionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·7 cites·20 claims
- 1992USD368830SCupLU CHIH W·Filed 1994·Granted Apr 16, 1996·48 cites·1 claims
- 2091US11854965B2Sidewall spacer structure enclosing conductive wire sidewalls to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·1 cites·20 claims
- 2191US11521970B2Semiconductor device and a method for fabricating the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 6, 2022·2 cites·20 claims
- 2291US11251118B2Self-aligned via structures with barrier layersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 15, 2022·4 cites·20 claims
- 2391US11183422B2Semiconductor structure and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 23, 2021·2 cites·20 claims
- 2491US10270028B1Memory device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·7 cites·20 claims
- 2591US2025364401A1Sidewall spacer structure enclosing conductive wire sidewalls to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2690US11521896B2Selective deposition of a protective layer to reduce interconnect structure critical dimensionsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 6, 2022·2 cites·20 claims
- 2790US10985312B2Methods of fabricating magneto-resistive random-access memory (MRAM) devices with self-aligned top electrode via and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Apr 20, 2021·2 cites·20 claims
- 2888US12444676B2Self-aligned via for interconnect structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Oct 14, 2025·0 cites·20 claims
- 2988US10461246B2Memory device and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 29, 2019·4 cites·20 claims
- 3088US8802560B1Method of fabricating an semiconductor interconnect structureTAIWAN SEMINCONDUCTOR MFG COMPANY LTD·Filed 2013·Granted Aug 12, 2014·11 cites·17 claims
- 3187US2024412975A1Method and structure for semiconductor device having gate spacer protection layerPARABELLUM STRATEGIC OPPORTUNITIES FUND LLC·Filed 2024·Application pending·0 cites
- 3287US2025308899A1Method and structure of cut end with self-aligned double patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3386US12368046B2Method and structure of cut end with self-aligned double patterningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 3486US10340181B2Interconnect structure including air gapTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 2, 2019·4 cites·20 claims
- 3586US2025275482A1Magnetic tunnel junction devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3686US2025349608A1Dual etch-stop layer structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3786US2025308932A1Methods of Etching Metals in Semiconductor DevicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 3885US12354881B2Methods of etching metals in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 8, 2025·0 cites·20 claims
- 3985US12302761B2Magnetic tunnel junction devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 4085US12261121B2Structure and method for a low-k dielectric with pillar-type air-gapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 25, 2025·0 cites·20 claims
- 4185US11798840B2Self-assembled dielectric on metal RIE lines to increase reliabilityTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Oct 24, 2023·1 cites·18 claims
- 4285US11569127B2Double patterning approach by direct metal etchTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 31, 2023·1 cites·20 claims
- 4384US11171052B2Methods of forming interconnect structures with selectively deposited pillars and structures formed therebyTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 9, 2021·3 cites·20 claims
- 4484US8728936B1Copper etching integration schemeTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted May 20, 2014·7 cites·18 claims
- 4584US2025329638A1Interconnection structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4684US2025253250A1Structure and Method for a Low-K Dielectric With Pillar-Type Air-GapsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4783US12464954B2Magneto-resistive random-access memory (MRAM) devices with self-aligned top electrode viaTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 4, 2025·0 cites·20 claims
- 4883US12074059B2Semiconductor arrangement and method of makingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 27, 2024·0 cites·20 claims
- 4983US11158518B2Methods of etching metals in semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 26, 2021·2 cites·20 claims
- 5083US10068770B2Method and structure for semiconductor device having gate spacer protection layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Sep 4, 2018·2 cites·20 claims
Showing the top 50 of 189 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →