Inventor · disambiguated record

Chun Sing Colin Lum

Also filed as: LUM CHUN SING COLIN

1 granted patent·91 citations·filing 2002–2002

52Inventor score

Technology areasH10W

Files withADVANPACK SOLUTIONS PTE LTD1

Top patents by PatentIndex Score

1 record

0186US7087458B2Method for fabricating a flip chip package with pillar bump and no flow underfillADVANPACK SOLUTIONS PTE LTD·Filed 2002·Granted Aug 8, 2006·91 cites·13 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →