Inventor · disambiguated record
Chun Nga Man
Also filed as: MAN CHUN NGA
0 granted patents·3 pending applications·0 citations·filing 2025–2025
Technology areasH10W
Files withNexperia BV3
Top patents by PatentIndex Score
3 records- 0152US2025385190A1Package comprising a first and a second semiconductor die, wherein a galvanic coupling is provided between those semiconductor dies, as well as a corresponding methodNexperia BV·Filed 2025·Application pending·0 cites
- 0252US2025385194A1Leadless package comprising a first and a second semiconductor die, wherein a galvanic isolation is provided between those semiconductor dies, as well as a corresponding methodNexperia BV·Filed 2025·Application pending·0 cites
- 0352US2025385188A1Leadless package comprising a first and a second semiconductor die, wherein a galvanic coupling is provided between those semiconductor dies, as well as a corresponding methodNexperia BV·Filed 2025·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →