Inventor · disambiguated record
Chandra Sekhar Mandalapu
Also filed as: MANDALAPU CHANDRA SEKHAR
0 granted patents·11 pending applications·0 citations·filing 2022–2024
Files withADVANCED MICRO DEVICES INC11
Top patents by PatentIndex Score
11 records- 0153US2025246580A1Integrated circuit die stack with a bridge dieADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0253US2025246519A1Integrated circuit die stack with a dual-sided bridge dieADVANCED MICRO DEVICES INC·Filed 2024·Application pending·0 cites
- 0353US2025112047A1Chip-on-wafer face-to-back hybrid bonding without support carrierADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0452US2025118706A1Chip package with a thermal carrierADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0552US2025167192A1Integrated circuit die stack with a bridge dieADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0651US2025364486A1Lateral silicon bridge for stacked diesADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0750US2024038596A1Double side transistors on same silicon waferADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 0849US2025323212A1Systems and methods for stack construction of a semiconductor device having redistribution layers in a silicon carrierADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 0948US2025293210A1Systems and methods for packaging a semiconductor deviceADVANCED MICRO DEVICES INC·Filed 2023·Application pending·0 cites
- 1048US2025293203A1Systems and methods for multi-tier multi-die modulesADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
- 1147US2025233087A1Systems and methods for embedding electronic components in substratesADVANCED MICRO DEVICES INC·Filed 2022·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Chandra Sekhar Mandalapu files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →