Inventor · disambiguated record
Chandrasekhar Mandalapu
Also filed as: MANDALAPU CHANDRASEKHAR
10 granted patents·2 pending applications·328 citations·filing 2018–2025
89Inventor score
Files withADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC9INVENSAS BONDING TECH INC2MICRON TECHNOLOGY INC1
Top patents by PatentIndex Score
12 records- 0198US11552041B2Chemical mechanical polishing for hybrid bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Jan 10, 2023·8 cites·29 claims
- 0298US10840205B2Chemical mechanical polishing for hybrid bondingINVENSAS BONDING TECH INC·Filed 2018·Granted Nov 17, 2020·146 cites·28 claims
- 0397US10964664B2DBI to Si bonding for simplified handle waferINVENSAS BONDING TECH INC·Filed 2019·Granted Mar 30, 2021·153 cites·17 claims
- 0496US11791307B2DBI to SI bonding for simplified handle waferADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2021·Granted Oct 17, 2023·4 cites·31 claims
- 0595US12300662B2DBI to SI bonding for simplified handle waferADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Granted May 13, 2025·2 cites·20 claims
- 0695US11664357B2Techniques for joining dissimilar materials in microelectronicsADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2019·Granted May 30, 2023·15 cites·19 claims
- 0782US2024379607A1Chemical mechanical polishing for hybrid bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2024·Application pending·0 cites
- 0881US12438122B2DBI to Si bonding for simplified handle waferADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Oct 7, 2025·0 cites·32 claims
- 0979US2025364481A1Post cmp processing for hybrid bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2025·Application pending·0 cites
- 1078US12381173B2Direct hybrid bonding of substrates having microelectronic components with different profiles and/or pitches at the bonding interfaceADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Aug 5, 2025·0 cites·26 claims
- 1154US12406959B2Post CMP processing for hybrid bondingADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2019·Granted Sep 2, 2025·0 cites·20 claims
- 1241US11862215B2Access line having a resistive layer for memory cell accessMICRON TECHNOLOGY INC·Filed 2021·Granted Jan 2, 2024·0 cites·37 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →