Inventor · disambiguated record
Chih-Wei Mao
Also filed as: MAO CHIH-WEI
0 granted patents·7 pending applications·0 citations·filing 2023–2024
Files withTONG HSING ELECTRONIC INDUSTRIES LTD7
Top patents by PatentIndex Score
7 records- 0167US2025249523A1Method for producing active metal ceramic substrateTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0265US2025010408A1Active metal brazing substrate material containing aluminum metal element and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 0364US2025162951A1Metal-ceramic substrate having double brazing layers and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0457US2025253203A1Metal ceramic substrate and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0556US2025162280A1Active metal brazing substrate and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0655US2025203785A1Circuit board structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 0755US2025010390A1Active metal brazing substrate material and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →