Inventor · disambiguated record
Chaein Moon
Also filed as: MOON CHAEIN
1 granted patent·8 pending applications·0 citations·filing 2023–2025
13Inventor score
Technology areasH10W
Files withSAMSUNG ELECTRONICS CO LTD9
Top patents by PatentIndex Score
9 records- 0165US12341124B2Solder reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jun 24, 2025·0 cites·20 claims
- 0264US2025309185A1Solder reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0354US2025174596A1Method of manufacturing semiconductor package and apparatus for manufacturing semiconductor package used thereforSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0454US2025201757A1Chip bonding apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0554US2025219014A1Semiconductor reflow apparatusSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0651US2024321823A1Semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0747US2024049400A1Solder reflow apparatus and method of manufacturing an electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0844US2025079373A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 0944US2025167056A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →