Inventor · disambiguated record
Christophe Morales
Also filed as: MORALES CHRISTOPHE
21 granted patents·4 pending applications·107 citations·filing 2003–2023
93Inventor score
Files withCOMMISSARIAT ENERGIE ATOMIQUE21LIBRALESSO LAURE1MORICEAU HUBERT1SOITEC SILICON ON INSULATOR1ZUSSY MARC1
Top patents by PatentIndex Score
25 records- 0193US7232739B2Multifunctional metallic bondingCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2006·Granted Jun 19, 2007·24 cites·23 claims
- 0289US7229898B2Methods for fabricating a germanium on insulator waferSOITEC SILICON ON INSULATOR·Filed 2005·Granted Jun 12, 2007·19 cites·20 claims
- 0384US7781300B2Method for producing mixed stacked structures, different insulating areas and/or localised vertical electrical conducting areasCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2005·Granted Aug 24, 2010·14 cites·74 claims
- 0481US7541263B2Method for providing mixed stacked structures, with various insulating zones and/or electrically conducting zones vertically localizedCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2005·Granted Jun 2, 2009·8 cites·57 claims
- 0579US8318586B2Nitrogen-plasma surface treatment in a direct bonding methodLIBRALESSO LAURE·Filed 2009·Granted Nov 27, 2012·17 cites·17 claims
- 0677US9922954B2Method for performing direct bonding between two structuresCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted Mar 20, 2018·2 cites·16 claims
- 0775US9427948B2Manufacturing a flexible structure by transfers of layersCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2012·Granted Aug 30, 2016·4 cites·14 claims
- 0871US9209068B2Method for the treatment and direct bonding of a material layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2012·Granted Dec 8, 2015·3 cites·13 claims
- 0967US9219004B2Method of fabricating polymer film in the cavity of a waferMORICEAU HUBERT·Filed 2011·Granted Dec 22, 2015·2 cites·16 claims
- 1066US10497609B2Method for direct bonding of substrates including thinning of the edges of at least one of the two substratesCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2016·Granted Dec 3, 2019·1 cites·10 claims
- 1165US8302278B2Method and device for separating a structureZUSSY MARC·Filed 2008·Granted Nov 6, 2012·2 cites·31 claims
- 1259US7189632B2Multifunctional metallic bondingCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2003·Granted Mar 13, 2007·7 cites·23 claims
- 1354US2023207515A1Method of assembly by direct bonding of electronic componentsCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2022·Application pending·0 cites
- 1453US11081463B2Bonding method with electron-stimulated desorptionCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2019·Granted Aug 3, 2021·0 cites·10 claims
- 1552US2023386894A1Strong base-assisted direct bonding methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 1652US2023387070A1Basic molecule-assisted direct bonding methodCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2023·Application pending·0 cites
- 1747US10727106B2Method for transfer of a useful layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Granted Jul 28, 2020·0 cites·18 claims
- 1847US8382933B2Molecular bonding method with cleaning with hydrofluoric acid in vapor phase and rinsing with deionized waterCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2008·Granted Feb 26, 2013·0 cites·11 claims
- 1947US7235461B2Method for bonding semiconductor structures togetherCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2004·Granted Jun 26, 2007·2 cites·19 claims
- 2046US10957539B2Method for bonding by direct adhesionCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Granted Mar 23, 2021·0 cites·15 claims
- 2146US10818500B2Method for wafer trimmingCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Granted Oct 27, 2020·0 cites·13 claims
- 2246US10651032B2Method for producing an epitaxial layer on a growth plateCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2017·Granted May 12, 2020·0 cites·18 claims
- 2346US7476595B2Method for the molecular bonding of microelectronic components to a polymer filmCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2004·Granted Jan 13, 2009·2 cites·19 claims
- 2444US10755967B2Method for transferring a useful layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2018·Granted Aug 25, 2020·0 cites·19 claims
- 2543US2015349191A1Method for producing a thick crystalline layerCOMMISSARIAT ENERGIE ATOMIQUE·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →