Inventor · disambiguated record
Chun Mu
Also filed as: MU CHUN · MU XIAO-CHUN
7 granted patents·1,498 citations·filing 1999–2003
90Inventor score
Files withINTEL CORP7
Top patents by PatentIndex Score
7 records- 0198US6271469B1Direct build-up layer on an encapsulated die packageINTEL CORP·Filed 1999·Granted Aug 7, 2001·711 cites·21 claims
- 0297US7189596B1Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structuresINTEL CORP·Filed 2000·Granted Mar 13, 2007·151 cites·24 claims
- 0397US6154366AStructures and processes for fabricating moisture resistant chip-on-flex packagesINTEL CORP·Filed 1999·Granted Nov 28, 2000·496 cites·29 claims
- 0492US6825063B2Integrated core microelectronic packageINTEL CORP·Filed 2003·Granted Nov 30, 2004·73 cites·21 claims
- 0590US6743664B2Flip-chip on flex for high performance packaging applicationsINTEL CORP·Filed 2001·Granted Jun 1, 2004·45 cites·13 claims
- 0655US6238954B1COF packaged semiconductorINTEL CORP·Filed 1999·Granted May 29, 2001·17 cites·6 claims
- 0754US6737754B2COF packaged semiconductorINTEL CORP·Filed 2001·Granted May 18, 2004·5 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →