Inventor · disambiguated record
Chan Loong Neo
Also filed as: NEO CHAN LOONG
0 granted patents·6 pending applications·0 citations·filing 2022–2023
Files withUTAC HEADQUARTERS PTE LTD6
Top patents by PatentIndex Score
6 records- 0150US2025038037A1Wafer lamination systems and methods thereof for semiconductor wafersUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0246US2023274979A1Plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0345US2023178413A1Plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 0445US2023154795A1Frame mask for singulating wafers by plasma etchingUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 0543US2023377896A1Back surface plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 0640US2023154796A1Plasma diced wafers and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →