Inventor · disambiguated record
Chee Peng Neo
Also filed as: NEO CHEE PENG
17 granted patents·1 pending application·178 citations·filing 2001–2013
95Inventor score
Top patents by PatentIndex Score
18 records- 0197US7309623B2Method of fabricating a stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 18, 2007·45 cites·23 claims
- 0293US7282390B2Stacked die-in-die BGA package with die having a recessMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·19 cites·20 claims
- 0387US7282392B2Method of fabricating a stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 16, 2007·8 cites·21 claims
- 0486US7799610B2Method of fabricating a stacked die having a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 21, 2010·7 cites·25 claims
- 0584US8373277B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2008·Granted Feb 12, 2013·6 cites·7 claims
- 0682US7358117B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2006·Granted Apr 15, 2008·5 cites·36 claims
- 0781US7332820B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted Feb 19, 2008·16 cites·84 claims
- 0880US7332819B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 19, 2008·16 cites·67 claims
- 0979US7575953B2Stacked die with a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 18, 2009·4 cites·22 claims
- 1078US7344969B2Stacked die in die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted Mar 18, 2008·13 cites·70 claims
- 1176US7371608B2Method of fabricating a stacked die having a recess in a die BGA packageMICRON TECHNOLOGY INC·Filed 2003·Granted May 13, 2008·12 cites·42 claims
- 1271US6779386B2Method and apparatus for detecting topographical features of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2001·Granted Aug 24, 2004·14 cites·15 claims
- 1369US6923045B2Method and apparatus for detecting topographical features of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2004·Granted Aug 2, 2005·11 cites·5 claims
- 1458US2013154117A1Stacked die in die bga packageMICRON TECHNOLOGY INC·Filed 2013·Application pending·0 cites
- 1554US8011513B2Semiconductor workpiece carriers and methods for processing semiconductor workpiecesMICRON TECHNOLOGY INC·Filed 2007·Granted Sep 6, 2011·1 cites·13 claims
- 1650US7213447B2Method and apparatus for detecting topographical features of microelectronic substratesMICRON TECHNOLOGY INC·Filed 2005·Granted May 8, 2007·1 cites·16 claims
- 1748US7691680B2Method of fabricating microelectronic component assemblies employing lead frames having reduced-thickness inner lengthsMICRON TECHNOLOGY INC·Filed 2008·Granted Apr 6, 2010·0 cites·19 claims
- 1835US8476109B2Semiconductor workpiece carriers and methods for processing semiconductor workpiecesNEO CHEE PENG·Filed 2011·Granted Jul 2, 2013·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →