Inventor · disambiguated record
Chee Yang Ng
Also filed as: NG CHEE YANG
22 granted patents·8 pending applications·9 citations·filing 2013–2024
89Inventor score
Top patents by PatentIndex Score
30 records- 0188US10549985B2Semiconductor package with a through port for sensor applicationsINFINEON TECHNOLOGIES AG·Filed 2017·Granted Feb 4, 2020·4 cites·15 claims
- 0286US11676879B2Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrierINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 13, 2023·2 cites·19 claims
- 0381US2025048531A1Power module with inductor-cooled power stageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0475US2025022768A1Method of forming a chip package and method of forming a semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0574US12150236B2Voltage regulator module with inductor-cooled power stageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Nov 19, 2024·0 cites·23 claims
- 0672US9628918B2Semiconductor device and a method for forming a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 18, 2017·3 cites·16 claims
- 0768US12136583B2Method of forming a chip package, method of forming a semiconductor arrangement, chip package, and semiconductor arrangementINFINEON TECHNOLOGIES AG·Filed 2021·Granted Nov 5, 2024·0 cites·9 claims
- 0865US12412797B2Hybrid embedded packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted Sep 9, 2025·0 cites·8 claims
- 0960US2025062273A1Package with Vertical Electronic Components Held Together by a ClipINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 1057US11521907B2Hybrid embedded packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Dec 6, 2022·0 cites·10 claims
- 1157US2024274563A1Solder structure with disruptable coating as solder spreading protectionINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1256US11174152B2Over-under sensor packaging with sensor spaced apart from control chipINFINEON TECHNOLOGIES AG·Filed 2019·Granted Nov 16, 2021·0 cites·20 claims
- 1355US12232302B2Dipped coated electronic module assembly with enhanced thermal distributionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Feb 18, 2025·0 cites·16 claims
- 1455US10304780B2Device having substrate with conductive pillarsINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 28, 2019·0 cites·10 claims
- 1554US12094807B2Stacked transistor chip package with source couplingINFINEON TECHNOLOGIES AG·Filed 2021·Granted Sep 17, 2024·0 cites·16 claims
- 1654US11984392B2Semiconductor package having a chip carrier with a pad offset featureINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 14, 2024·0 cites·20 claims
- 1754US2024162136A1Package for a lateral power transistorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1852US2025054831A1Method for fabricating topside cooled semiconductor packages by film assisted molding and a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1951US10501312B2Over-under sensor packaging with sensor spaced apart from control chipINFINEON TECHNOLOGIES AG·Filed 2017·Granted Dec 10, 2019·0 cites·20 claims
- 2050US11289436B2Semiconductor package having a laser-activatable mold compoundINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Mar 29, 2022·0 cites·13 claims
- 2150US10163812B2Device having substrate with conductive pillarsINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 25, 2018·0 cites·8 claims
- 2248US11039231B2Package with acoustic sensing device(s) and millimeter wave sensing elementsINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 15, 2021·0 cites·19 claims
- 2348US2023027669A1Electronic system having intermetallic connection structure with central intermetallic mesh structure and mesh-free exterior structuresINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2446US10109592B2Semiconductor chip with electrically conducting layerINFINEON TECHNOLOGIES AG·Filed 2013·Granted Oct 23, 2018·0 cites·15 claims
- 2546US2023335516A1Manufacturing package by solderable or sinterable metallic connection structure applied on sacrificial carrierINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 2645US10224260B2Semiconductor package with air gapINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 5, 2019·0 cites·15 claims
- 2744US9117807B2Integrated passives package, semiconductor module and method of manufacturingINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 25, 2015·0 cites·19 claims
- 2842US11393743B2Semiconductor assembly with conductive frame for I/O standoff and thermal dissipationINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 19, 2022·0 cites·20 claims
- 2939US9868632B2Molded cavity package with embedded conductive layer and enhanced sealingINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jan 16, 2018·0 cites·14 claims
- 3036US10770399B2Semiconductor package having a filled conductive cavityINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 8, 2020·0 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Chee Yang Ng files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →