Inventor · disambiguated record
Chyi-Tsong Ni
Also filed as: NI CHYI-TSONG
58 granted patents·17 pending applications·205 citations·filing 1997–2025
98Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD57TAIWAN SEMICONDUCTOR MFG11MOSEL VITELIC INC2CHIEN TING-YING1CHIU YI HSUN1
Top patents by PatentIndex Score
75 records- 0194US11437477B1Fluorine-free interface for semiconductor device performance gainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 6, 2022·3 cites·20 claims
- 0293US12194510B2Method and apparatus for semiconductor waferTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 14, 2025·1 cites·20 claims
- 0393US9139423B2Micro electro mechanical system structuresCHIEN TING-YING·Filed 2012·Granted Sep 22, 2015·53 cites·20 claims
- 0492US11754691B2Target measurement device and method for measuring a targetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 12, 2023·4 cites·20 claims
- 0590US11938521B2Method and apparatus for semiconductor wafer cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 26, 2024·1 cites·19 claims
- 0686US12509773B2Semiconductor processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Dec 30, 2025·0 cites·20 claims
- 0786US12347772B2Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 1, 2025·1 cites·21 claims
- 0886US11854851B2Interface toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·1 cites·19 claims
- 0986US7635651B2Method of smoothening dielectric layerTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 22, 2009·12 cites·20 claims
- 1086US2025331275A1Fluorine-free interface for semiconductor device performance gainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 1185US12363985B2Fluorine-free interface for semiconductor device performance gainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 15, 2025·0 cites·20 claims
- 1284US12094849B2Atomic layer deposition bonding layer for joining two semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·1 cites·20 claims
- 1383US12084769B2Semiconductor processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 10, 2024·0 cites·20 claims
- 1483US9650243B2Method and apparatus for a seal ring structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 16, 2017·4 cites·20 claims
- 1583US2024339310A1Apparatus and method for physical vapor depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1682US12406869B2Systems and methods for humidity control of FOUP during semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Sep 2, 2025·0 cites·20 claims
- 1782US6953608B2Solution for FSG induced metal corrosion & metal peeling defects with extra bias liner and smooth RF bias ramp upTAIWAN SEMICONDUCTOR MFG·Filed 2003·Granted Oct 11, 2005·31 cites·25 claims
- 1882US2024384414A1Device and methods for chemical vapor depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1982US2025323079A1Systems and methods for humidity control of foup during semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2082US2025309190A1Heterogenous bonding layers for direct semiconductor bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2181US10361449B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jul 23, 2019·1 cites·20 claims
- 2280US2025041906A1Method and apparatus for semiconductor wafer cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 2379US12400996B2Heterogenous bonding layers for direct semiconductor bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 2479US11695150B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·20 claims
- 2579US9123754B2Bonding alignment tool and methodSHIH YUN-TAI·Filed 2011·Granted Sep 1, 2015·6 cites·20 claims
- 2679US6548348B1Method of forming a storage node contact hole in a porous insulator layerTAIWAN SEMICONDUCTOR MFG·Filed 2001·Granted Apr 15, 2003·26 cites·10 claims
- 2778US7851358B2Low temperature method for minimizing copper hillock defectsTAIWAN SEMICONDUCTOR MFG·Filed 2005·Granted Dec 14, 2010·8 cites·20 claims
- 2877US11908909B2Fluorine-free interface for semiconductor device performance gainTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Feb 20, 2024·0 cites·20 claims
- 2977US10692966B2Deep trench capacitor with scallop profileTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jun 23, 2020·3 cites·20 claims
- 3076US12368062B2Reflector and/or method for ultraviolet curing of semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Granted Jul 22, 2025·0 cites·20 claims
- 3175US12014912B2Apparatus and method for physical vapor depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jun 18, 2024·0 cites·20 claims
- 3275US11101491B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·0 cites·20 claims
- 3375US2024379471A1Semiconductor processing tool and methods of operationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3474US12276024B2Device and methods for chemical vapor depositionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 15, 2025·0 cites·20 claims
- 3574US9240611B2Semiconductor structures having a micro-battery and methods for making the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 19, 2016·1 cites·20 claims
- 3674US2024379548A1Semiconductor devices and methods of manufacturing thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3774US2024371921A1Structure formation in a semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3874US2024363578A1Atomic layer deposition bonding layer for joining two semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 3974US2024387200A1Vent port diffuserTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4073US12405359B2Target measurement device and method for measuring a targetTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Sep 2, 2025·0 cites·20 claims
- 4173US12051609B2Systems and methods for humidity control of FOUP during semiconductor fabricationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 30, 2024·0 cites·20 claims
- 4273US2024384408A1Apparatus and method of manufacturing interconnect structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4373US2025270690A1Deflector for chamber cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 4472US12205921B2Heterogenous bonding layers for direct semiconductor bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 21, 2025·0 cites·20 claims
- 4572US2024087935A1Interface toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 4671US11851761B2Semiconductor processing toolTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 4770US12492468B2SACVD system and method for reducing obstructions thereinTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 9, 2025·0 cites·20 claims
- 4870US11929267B1Reflector and/or method for ultraviolet curing of semiconductorTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·20 claims
- 4969US11721662B2Wafer bonding method and wafer bonding apparatusTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 8, 2023·0 cites·20 claims
- 5068US12325913B2Deflector for chamber cleaningTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jun 10, 2025·0 cites·20 claims
Showing the top 50 of 75 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →