Inventor · disambiguated record
Christoph Oetzel
Also filed as: OETZEL CHRISTOPH
8 granted patents·1 pending application·5 citations·filing 2015–2023
75Inventor score
Files withPINK GMBH THERMOSYSTEME9
Top patents by PatentIndex Score
9 records- 0188US11676843B2System and method for connecting electronic assembliesPINK GMBH THERMOSYSTEME·Filed 2020·Granted Jun 13, 2023·3 cites·33 claims
- 0285US11998999B2Soldering or sintering system with plurality of modules and temperature controlPINK GMBH THERMOSYSTEME·Filed 2021·Granted Jun 4, 2024·1 cites·27 claims
- 0380US12021058B2System and method for connecting electronic assembliesPINK GMBH THERMOSYSTEME·Filed 2022·Granted Jun 25, 2024·1 cites·20 claims
- 0458US11351623B2Heat transfer device for producing a soldered connection of electrical componentsPINK GMBH THERMOSYSTEME·Filed 2020·Granted Jun 7, 2022·0 cites·17 claims
- 0554US12318858B2Diffusion soldering and/or sintering device, die and system, for connecting components of at least one electronic assemblyPINK GMBH THERMOSYSTEME·Filed 2022·Granted Jun 3, 2025·0 cites·26 claims
- 0653US2025256476A1Sintering device and methodPINK GMBH THERMOSYSTEME·Filed 2023·Application pending·0 cites
- 0752US12121987B1Multifunctional sintering or diffusion soldering device and pressing toolPINK GMBH THERMOSYSTEME·Filed 2022·Granted Oct 22, 2024·0 cites·15 claims
- 0849US10596649B2Heat transfer device for producing a soldered connection of electrical componentsPINK GMBH THERMOSYSTEME·Filed 2015·Granted Mar 24, 2020·0 cites·18 claims
- 0931US11491567B2Soldering device and a method for producing a solder connection of components using adhesive material for temporary connection of the componentsPINK GMBH THERMOSYSTEME·Filed 2018·Granted Nov 8, 2022·0 cites·20 claims
Join the waitlist — get patent alerts
Get an alert when Christoph Oetzel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →