Inventor · disambiguated record
Ching-Chung Pai
Also filed as: PAI CHING-CHUNG
3 granted patents·18 citations·filing 2007–2012
68Inventor score
Technology areasH10P
Top patents by PatentIndex Score
3 records- 0182US8658483B2Method of fabricating an integrated circuit device having backside bevel protectionTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Feb 25, 2014·6 cites·20 claims
- 0277US8338242B2Backside bevel protectionHSU JUNG-TZU·Filed 2011·Granted Dec 25, 2012·6 cites·20 claims
- 0375US7732299B2Process for wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2007·Granted Jun 8, 2010·6 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →